Membership
Tour
Register
Log in
Sonja Koller
Follow
Person
Regensburg, DE
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Printed wiring-board islands for connecting chip packages and metho...
Patent number
11,877,403
Issue date
Jan 16, 2024
Intel Corporation
Georg Seidemann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Single metal cavity antenna in package connected to an integrated t...
Patent number
11,784,143
Issue date
Oct 10, 2023
Intel Corporation
Sonja Koller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages, and methods for forming semiconductor packages
Patent number
11,764,187
Issue date
Sep 19, 2023
Intel Corporation
Bernd Waidhas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package integrated cavity resonator antenna
Patent number
11,646,498
Issue date
May 9, 2023
Intel Corporation
Kilian Roth
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Magnetic coils in locally thinned silicon bridges and methods of as...
Patent number
11,456,116
Issue date
Sep 27, 2022
Intel Corporation
Andreas Augustin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit devices with front-end metal structures
Patent number
11,410,908
Issue date
Aug 9, 2022
Intel Corporation
Reinhard Mahnkopf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Patch antennas stitched to systems in packages and methods of assem...
Patent number
11,374,323
Issue date
Jun 28, 2022
Intel Corporation
Andreas Augustin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead frame with angular deflections and wrapped printed wiring boar...
Patent number
11,145,577
Issue date
Oct 12, 2021
Intel Corporation
Sonja Koller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printed wiring-board islands for connecting chip packages and metho...
Patent number
11,134,573
Issue date
Sep 28, 2021
Intel Corporation
Georg Seidemann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Contoured-on-heat-sink, wrapped printed wiring boards for system-in...
Patent number
11,037,855
Issue date
Jun 15, 2021
Intel IP Corporation
Sonja Koller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Carrier substrate for a semiconductor device and a method for formi...
Patent number
10,658,201
Issue date
May 19, 2020
Intel IP Corporation
Sonja Koller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposer with conductive routing exposed on sidewalls
Patent number
10,651,102
Issue date
May 12, 2020
Intel IP Corporation
Klaus Reingruber
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power mesh-on-die trace bumping
Patent number
10,629,731
Issue date
Apr 21, 2020
Intel IP Corporation
Bernd Waidhas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices, and a method for forming a semiconductor device
Patent number
10,535,578
Issue date
Jan 14, 2020
Intel IP Corporation
Reinhard Mahnkopf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package configurations to reduce stiffness
Patent number
10,373,844
Issue date
Aug 6, 2019
Intel IP Corporation
Sven Albers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low thermal resistance hanging die package
Patent number
10,347,558
Issue date
Jul 9, 2019
Intel IP Corporation
Christian Geissler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power mesh-on-die trace bumping
Patent number
10,263,106
Issue date
Apr 16, 2019
Intel IP Corporation
Bernd Waidhas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cooler for semiconductor devices
Patent number
10,121,726
Issue date
Nov 6, 2018
Intel IP Corporation
Sven Albers
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Device with switchable heat path
Patent number
10,091,866
Issue date
Oct 2, 2018
Intel IP Corporation
Sonja Koller
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Wearable computing device
Patent number
9,921,694
Issue date
Mar 20, 2018
Intel Corporation
Sven Albers
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Integrated circuit package configurations to reduce stiffness
Patent number
9,653,324
Issue date
May 16, 2017
Intel IP Corporation
Sven Albers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package configurations to reduce stiffness
Patent number
9,397,019
Issue date
Jul 19, 2016
Intel IP Corporation
Sven Albers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Contact pads for integrated circuit packages
Patent number
9,368,461
Issue date
Jun 14, 2016
Intel Corporation
Sven Albers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Contact pads for integrated circuit packages
Patent number
9,299,672
Issue date
Mar 29, 2016
Intel Corporation
Sven Albers
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
HETEROGENEOUS PACKAGES HAVING THERMAL TOWERS
Publication number
20230317551
Publication date
Oct 5, 2023
Intel Corporation
Vishnu Prasad
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGES HAVING REDUCED Z-HEIGHT AND HEAT PATH
Publication number
20230317544
Publication date
Oct 5, 2023
Intel Corporation
Jan Proschwitz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL STACK COOLING WINGS
Publication number
20230317681
Publication date
Oct 5, 2023
Intel Corporation
Sonja Koller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING ARCHITECTURE WITH THERMALLY CONDUCTIVE INTEGRATED CIRCUIT...
Publication number
20230299043
Publication date
Sep 21, 2023
Intel Corporation
Bernd Waidhas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS AROUND INDIVIDUAL DIES
Publication number
20230298953
Publication date
Sep 21, 2023
Intel Corporation
Pouya Talebbeydokhti
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGES HAVING REDUCED Z-HEIGHT
Publication number
20230300975
Publication date
Sep 21, 2023
Intel Corporation
Jan Proschwitz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING ARCHITECTURE WITH ACTIVE COOLING
Publication number
20230282546
Publication date
Sep 7, 2023
Intel Corporation
Bernd Waidhas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED DIE PACKAGING ARCHITECTURE WITH CONDUCTIVE VIAS ON INTERPOSER
Publication number
20230282615
Publication date
Sep 7, 2023
Intel Corporation
Thomas Wagner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING ARCHITECTURE WITH REINFORCEMENT STRUCTURE IN PACKAGE SUBS...
Publication number
20230268286
Publication date
Aug 24, 2023
Intel Corporation
Mohan Prashanth Javare Gowda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING ARCHITECTURE WITH REINFORCEMENT STRUCTURE IN PACKAGE SUBS...
Publication number
20230268291
Publication date
Aug 24, 2023
Intel Corporation
Mohan Prashanth Javare Gowda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PATCH ANTENNAS STITCHED TO SYSTEMS IN PACKAGES AND METHODS OF ASSEM...
Publication number
20220294115
Publication date
Sep 15, 2022
Intel Corporation
Andreas Augustin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED WIRING-BOARD ISLANDS FOR CONNECTING CHIP PACKAGES AND METHO...
Publication number
20220015244
Publication date
Jan 13, 2022
Intel Corporation
Georg Seidemann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SINGLE METAL CAVITY ANTENNA IN PACKAGE CONNECTED TO AN INTEGRATED T...
Publication number
20200373259
Publication date
Nov 26, 2020
Intel Corporation
Sonja KOLLER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE INTEGRATED CAVITY RESONATOR ANTENNA
Publication number
20200365996
Publication date
Nov 19, 2020
Intel Corporation
Kilian ROTH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED WIRING-BOARD ISLANDS FOR CONNECTING CHIP PACKAGES AND METHO...
Publication number
20200352035
Publication date
Nov 5, 2020
Intel Corporation
Georg Seidemann
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor Packages, and Methods for Forming Semiconductor Packages
Publication number
20200227388
Publication date
Jul 16, 2020
Intel IP Corporation
Bernd Waidhas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PATCH ANTENNAS STITCHED TO SYSTEMS IN PACKAGES AND METHODS OF ASSEM...
Publication number
20200144723
Publication date
May 7, 2020
Intel IP Corporation
Andreas Augustin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MAGNETIC COILS IN LOCALLY THINNED SILICON BRIDGES AND METHODS OF AS...
Publication number
20200111607
Publication date
Apr 9, 2020
Intel IP Corporation
Andreas Augustin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONTOURED-ON-HEAT-SINK, WRAPPED PRINTED WIRING BOARDS FOR SYSTEM-IN...
Publication number
20200043826
Publication date
Feb 6, 2020
Intel IP Corporation
Sonja Koller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT DEVICES WITH FRONT-END METAL STRUCTURES
Publication number
20190393130
Publication date
Dec 26, 2019
Intel IP Corporation
Reinhard Mahnkopf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL CONTACTS AT PERIPHERY OF INTEGRATED CIRCUIT PACKAGES
Publication number
20190393125
Publication date
Dec 26, 2019
Intel IP Corporation
Sonja Koller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Carrier substrate for a semiconductor device and a method for formi...
Publication number
20190295857
Publication date
Sep 26, 2019
Intel IP Corporation
Sonja Koller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTROMAGNETIC SHIELDING CAP, AN ELECTRICAL SYSTEM AND A METHOD FO...
Publication number
20190297758
Publication date
Sep 26, 2019
Intel IP Corporation
Sonja KOLLER
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
LEAD FRAME WITH ANGULAR DEFLECTIONS AND WRAPPED PRINTED WIRING BOAR...
Publication number
20190267312
Publication date
Aug 29, 2019
Intel IP Corporation
Sonja Koller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL CONDUCTION DEVICES AND METHODS FOR EMBEDDED ELECTRONIC DEVICES
Publication number
20190214327
Publication date
Jul 11, 2019
Sonja Koller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERPOSER WITH ANGLED VIAS
Publication number
20190206777
Publication date
Jul 4, 2019
Intel IP Corporation
Sonja Koller
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
POWER MESH-ON-DIE TRACE BUMPING
Publication number
20190207027
Publication date
Jul 4, 2019
Intel IP Corporation
Bernd Waidhas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANISOTROPICALLY CONDUCTIVE ELASTIC ADHESIVE FILMS IN SEMICONDUCTOR...
Publication number
20190198448
Publication date
Jun 27, 2019
Intel IP Corporation
Sonja Koller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor devices, and a Method for Forming a Semiconductor device
Publication number
20190103333
Publication date
Apr 4, 2019
Intel IP Corporation
Reinhard Mahnkopf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SMART ACCELEROMETER CANTILEVER
Publication number
20190004083
Publication date
Jan 3, 2019
Intell IP Corporation
Sonja Koller
G01 - MEASURING TESTING