Soo Yeow Heng

Follow

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor devices using a bond program...
- Patent number 7,029,929
- Issue date Apr 18, 2006
- National Semiconductor Corporation
- Qin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond program verification system
- Patent number 6,789,235
- Issue date Sep 7, 2004
- National Semiconductor Corporation
- Qin Lu
- H01 - BASIC ELECTRIC ELEMENTS