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Soo Young CHOI
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Cheongju-si, KR
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last 30 patents
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Patent Grant
Chip substrate comprising a groove portion and chip package using t...
Patent number
9,653,664
Issue date
May 16, 2017
Point Engineering Co., Ltd.
Sin Seok Han
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
CHIP SUBSTRATE COMPRISING A GROOVE PORTION AND CHIP PACKAGE USING T...
Publication number
20160380168
Publication date
Dec 29, 2016
Point Engineering Co., Ltd.
Sin Seok HAN
H01 - BASIC ELECTRIC ELEMENTS