Sooho Shin

Person

Hwaseong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices including a thick metal layer and a bump
- Patent number 12,080,663
- Issue date Sep 3, 2024
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a thick metal layer and a bump
- Patent number 11,817,408
- Issue date Nov 14, 2023
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory devices having protruding contact portions
- Patent number 11,723,191
- Issue date Aug 8, 2023
- Samsung Electronics Co., Ltd.
- Minsu Choi
Information Patent Grant
Semiconductor devices including a thick metal layer and a bump
- Patent number 11,557,556
- Issue date Jan 17, 2023
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a thick metal layer and a bump
- Patent number 11,049,827
- Issue date Jun 29, 2021
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with alignment keys
- Patent number 10,332,842
- Issue date Jun 25, 2019
- Samsung Electronics Co., Ltd.
- Kiseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating semiconductor devices
- Patent number 10,103,030
- Issue date Oct 16, 2018
- Samsung Electronics Co., Ltd.
- Hyo-sun Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with alignment keys
- Patent number 10,026,694
- Issue date Jul 17, 2018
- Samsung Electronics Co., Ltd.
- Kiseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device including narrower storage node contact...
- Patent number 8,878,273
- Issue date Nov 4, 2014
- Samsung Electronics Co., Ltd.
- Daeik Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP
- Publication number 20240047390
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Minjung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20230337415
- Publication date Oct 19, 2023
- Samsung Electronics Co., Ltd.
- Minsu Choi
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230328951
- Publication date Oct 12, 2023
- Samsung Electronics Co., Ltd.
- DONG-SIK PARK
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP
- Publication number 20230154876
- Publication date May 18, 2023
- Samsung Electronics Co., Ltd.
- Minjung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230108547
- Publication date Apr 6, 2023
- Samsung Electronics Co., Ltd.
- Jihoon CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20220028860
- Publication date Jan 27, 2022
- Samsung Electronics Co., Ltd.
- Minsu Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP
- Publication number 20210280541
- Publication date Sep 9, 2021
- Samsung Electronics Co., Ltd.
- Minjung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP
- Publication number 20210043591
- Publication date Feb 11, 2021
- Samsung Electronics Co., Ltd.
- Minjung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH ALIGNMENT KEYS
- Publication number 20180331046
- Publication date Nov 15, 2018
- Samsung Electronics Co., Ltd.
- KISEOK LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH ALIGNMENT KEYS
- Publication number 20180096947
- Publication date Apr 5, 2018
- Samsung Electronics Co., Ltd.
- KISEOK LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING SEMICONDUCTOR DEVICES
- Publication number 20170200616
- Publication date Jul 13, 2017
- Samsung Electronics Co., Ltd.
- Hyo-sun MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20120217559
- Publication date Aug 30, 2012
- SAMSUNG ELECTRONICS CO., LTD.
- Daeik Kim
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor devices including a thick metal layer and a bump

Semiconductor devices including a thick metal layer and a bump

Semiconductor memory devices having protruding contact portions

Semiconductor devices including a thick metal layer and a bump

Semiconductor devices including a thick metal layer and a bump

Semiconductor devices with alignment keys

Methods of fabricating semiconductor devices

Semiconductor devices with alignment keys

Semiconductor memory device including narrower storage node contact...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP

SEMICONDUCTOR MEMORY DEVICES AND METHODS OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MEMORY DEVICES AND METHODS OF FABRICATING THE SAME

SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP

SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP

SEMICONDUCTOR DEVICES WITH ALIGNMENT KEYS

SEMICONDUCTOR DEVICES WITH ALIGNMENT KEYS

METHODS OF FABRICATING SEMICONDUCTOR DEVICES

SEMICONDUCTOR MEMORY DEVICE