Soohwan LEE

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Suwon-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having molding member and heat dissipation me...
- Patent number 11,482,507
- Issue date Oct 25, 2022
- Samsung Electronics Co., Ltd.
- Sunchul Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240194639
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- Sang Cheon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240088006
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Sangcheon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210057380
- Publication date Feb 25, 2021
- Samsung Electronics Co., Ltd.
- Sunchul KIM
- H01 - BASIC ELECTRIC ELEMENTS