Soojae PARK

Person

Seongnam-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Chip capacitor including capacitor wires
- Patent number 12,080,479
- Issue date Sep 3, 2024
- Samsung Electronics Co., Ltd.
- Soojae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,508,681
- Issue date Nov 22, 2022
- Samsung Electronics Co., Ltd.
- Soojae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and semiconductor package including the same
- Patent number 10,777,495
- Issue date Sep 15, 2020
- Samsung Electronics Co., Ltd.
- Soojae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package frame and method of manufacturing semiconductor package usi...
- Patent number 10,147,616
- Issue date Dec 4, 2018
- Samsung Electronics Co., Ltd.
- Soojae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate, method for fabricating the same, and package dev...
- Patent number 10,134,666
- Issue date Nov 20, 2018
- Samsung Electronics Co., Ltd.
- Soojae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate, method for fabricating the same, and package dev...
- Patent number 9,960,107
- Issue date May 1, 2018
- Samsung Electronics Co., Ltd.
- Soojae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having magnetic connection member
- Patent number 9,402,315
- Issue date Jul 26, 2016
- Samsung Electronics Co., Ltd.
- Hyunsuk Chun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package
- Patent number 9,397,052
- Issue date Jul 19, 2016
- Samsung Electronics Co., Ltd.
- Soojae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including heat exhaust part
- Patent number 9,391,009
- Issue date Jul 12, 2016
- Samsung Electronics Co., Ltd.
- Eon Soo Jang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRE STRUCTURE, WIRE CAPACITOR INCLUDING WIRE STRUCTURE, AND ELECTR...
- Publication number 20240021663
- Publication date Jan 18, 2024
- Samsung Electronics Co., Ltd.
- SOOJAE PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR WIRE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20240006122
- Publication date Jan 4, 2024
- Samsung Electronics Co., Ltd.
- SOOJAE PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR-WIRE-EMBEDDED WIRING BOARD
- Publication number 20230319998
- Publication date Oct 5, 2023
- Samsung Electronics Co., Ltd.
- SOOJAE PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CAPACITOR INCLUDING CAPACITOR WIRES
- Publication number 20230307180
- Publication date Sep 28, 2023
- Samsung Electronics Co., Ltd.
- SOOJAE PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR WIRE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20230245828
- Publication date Aug 3, 2023
- Samsung Electronics Co., Ltd.
- SOOJAE PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20210043592
- Publication date Feb 11, 2021
- Samsung Electronics Co., Ltd.
- Soojae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20190252306
- Publication date Aug 15, 2019
- Samsung Electronics Co., Ltd.
- SOOJAE PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE, METHOD FOR FABRICATING THE SAME, AND PACKAGE DEV...
- Publication number 20180211909
- Publication date Jul 26, 2018
- Samsung Electronics Co., Ltd.
- Soojae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE, METHOD FOR FABRICATING THE SAME, AND PACKAGE DEV...
- Publication number 20170194240
- Publication date Jul 6, 2017
- Samsung Electronics Co., Ltd.
- Soojae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND METHODS FOR MANUFACTURING THE SAME
- Publication number 20160329275
- Publication date Nov 10, 2016
- Samsung Electronics Co., Ltd.
- Soojae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FRAME AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USI...
- Publication number 20160120032
- Publication date Apr 28, 2016
- SOOJAE PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING MAGNETIC CONNECTION MEMBER
- Publication number 20150115468
- Publication date Apr 30, 2015
- Samsung Electronics Co., Ltd.
- Hyunsuk CHUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING HEAT EXHAUST PART
- Publication number 20150054148
- Publication date Feb 26, 2015
- Eon-Soo JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20150048522
- Publication date Feb 19, 2015
- Samsung Electronics Co., Ltd.
- Soojae PARK
- H01 - BASIC ELECTRIC ELEMENTS

Soojae PARK

Person

Patents Grantslast 30 patents

Chip capacitor including capacitor wires

Semiconductor package and method of fabricating the same

Printed circuit board and semiconductor package including the same

Package frame and method of manufacturing semiconductor package usi...

Package substrate, method for fabricating the same, and package dev...

Package substrate, method for fabricating the same, and package dev...

Semiconductor package having magnetic connection member

Semiconductor package

Semiconductor packages including heat exhaust part

Patents Applicationslast 30 patents

WIRE STRUCTURE, WIRE CAPACITOR INCLUDING WIRE STRUCTURE, AND ELECTR...

CAPACITOR WIRE AND ELECTRONIC DEVICE INCLUDING THE SAME

CAPACITOR-WIRE-EMBEDDED WIRING BOARD

CHIP CAPACITOR INCLUDING CAPACITOR WIRES

CAPACITOR WIRE AND ELECTRONIC DEVICE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

PACKAGE SUBSTRATE, METHOD FOR FABRICATING THE SAME, AND PACKAGE DEV...

PACKAGE SUBSTRATE, METHOD FOR FABRICATING THE SAME, AND PACKAGE DEV...

PACKAGE SUBSTRATE AND METHODS FOR MANUFACTURING THE SAME

PACKAGE FRAME AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USI...

SEMICONDUCTOR PACKAGE HAVING MAGNETIC CONNECTION MEMBER

SEMICONDUCTOR PACKAGES INCLUDING HEAT EXHAUST PART

SEMICONDUCTOR PACKAGE