Sook Woon Chan

Person

Melaka, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with a heterogeneous solder joint and method f...
- Patent number 11,682,644
- Issue date Jun 20, 2023
- Infineon Technologies AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Over-under sensor packaging with sensor spaced apart from control chip
- Patent number 11,174,152
- Issue date Nov 16, 2021
- Infineon Technologies AG
- Sook Woon Chan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacturing a package using plateable encapsulant
- Patent number 11,081,417
- Issue date Aug 3, 2021
- Infineon Technologies AG
- Sook Woon Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Over-under sensor packaging with sensor spaced apart from control chip
- Patent number 10,501,312
- Issue date Dec 10, 2019
- Infineon Technologies AG
- Sook Woon Chan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and method for fabricating a semiconductor pa...
- Patent number 10,490,470
- Issue date Nov 26, 2019
- Infineon Technologies AG
- Hock Heng Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with plateable encapsulant and a method for m...
- Patent number 10,396,007
- Issue date Aug 27, 2019
- Infineon Technologies AG
- Sook Woon Chan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Molded package structure with glue bleed stopper for sealing a MEMs...
- Patent number 9,475,691
- Issue date Oct 25, 2016
- Infineon Technologies AG
- Kok Yau Chua
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH A HETEROGENEOUS SOLDER JOINT AND METHOD F...
- Publication number 20220005778
- Publication date Jan 6, 2022
- INFINEON TECHNOLOGIES AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Over-Under Sensor Packaging with Sensor Spaced Apart from Control Chip
- Publication number 20200048075
- Publication date Feb 13, 2020
- INFINEON TECHNOLOGIES AG
- Sook Woon Chan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Manufacturing a package using plateable encapsulant
- Publication number 20190341324
- Publication date Nov 7, 2019
- INFINEON TECHNOLOGIES AG
- Sook Woon CHAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEM AND METHOD FOR OVER UNDER SENSOR PACKAGING
- Publication number 20190023561
- Publication date Jan 24, 2019
- INFINEON TECHNOLOGIES AG
- Sook Woon Chan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor package and method for fabricating a semiconductor pa...
- Publication number 20180174935
- Publication date Jun 21, 2018
- INFINEON TECHNOLOGIES AG
- Hock Heng CHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing a package using plateable encapsulant
- Publication number 20170256472
- Publication date Sep 7, 2017
- INFINEON TECHNOLOGIES AG
- Sook Woon CHAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Sook Woon Chan

Person

Patents Grantslast 30 patents

Semiconductor device with a heterogeneous solder joint and method f...

Over-under sensor packaging with sensor spaced apart from control chip

Manufacturing a package using plateable encapsulant

Over-under sensor packaging with sensor spaced apart from control chip

Semiconductor package and method for fabricating a semiconductor pa...

Semiconductor package with plateable encapsulant and a method for m...

Molded package structure with glue bleed stopper for sealing a MEMs...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH A HETEROGENEOUS SOLDER JOINT AND METHOD F...

Over-Under Sensor Packaging with Sensor Spaced Apart from Control Chip

Manufacturing a package using plateable encapsulant

SYSTEM AND METHOD FOR OVER UNDER SENSOR PACKAGING

Semiconductor package and method for fabricating a semiconductor pa...

Manufacturing a package using plateable encapsulant