SooMoon Park

Person

Jinju-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming mold underfill using dis...
- Patent number 8,785,251
- Issue date Jul 22, 2014
- STATS ChipPAC, Ltd.
- SooMoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with thermal dispersal structur...
- Patent number 8,692,365
- Issue date Apr 8, 2014
- Stats Chippac Ltd.
- DongSoo Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming mold underfill using dis...
- Patent number 8,569,895
- Issue date Oct 29, 2013
- STATS ChipPAC, Ltd.
- SooMoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming mold underfill using dis...
- Patent number 8,193,036
- Issue date Jun 5, 2012
- STATS ChipPAC, Ltd.
- SooMoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system flip chip
- Patent number 8,143,096
- Issue date Mar 27, 2012
- Stats Chippac Ltd.
- SooMoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with interconnect and method of...
- Patent number 8,115,293
- Issue date Feb 14, 2012
- Stats Chippac Ltd.
- DongSoo Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with underfill
- Patent number 7,682,872
- Issue date Mar 23, 2010
- Stats Chippac Ltd.
- SooMoon Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Mold Underfill Using Dis...
- Publication number 20140004659
- Publication date Jan 2, 2014
- STATS ChipPAC, Ltd.
- SooMoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH THERMAL DISPERSAL STRUCTUR...
- Publication number 20120319267
- Publication date Dec 20, 2012
- DongSoo Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Mold Underfill Using Dis...
- Publication number 20120211904
- Publication date Aug 23, 2012
- STATS ChipPAC, Ltd.
- SooMoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Mold Underfill Using Dis...
- Publication number 20120061858
- Publication date Mar 15, 2012
- STATS ChipPAC, Ltd.
- SooMoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECT AND METHOD OF...
- Publication number 20110133325
- Publication date Jun 9, 2011
- DongSoo Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH POST TYPE INTERCONNECTOR A...
- Publication number 20100244212
- Publication date Sep 30, 2010
- Jong-Woo Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Substrate and Method of Forming Conformal Solder Wet-...
- Publication number 20100237500
- Publication date Sep 23, 2010
- STATS ChipPAC, Ltd.
- ChoongHwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM FLIP CHIP
- Publication number 20100044882
- Publication date Feb 25, 2010
- SooMoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH UNDERFILL
- Publication number 20080211111
- Publication date Sep 4, 2008
- SooMoon Park
- H01 - BASIC ELECTRIC ELEMENTS

SooMoon Park

Person

Patents Grantslast 30 patents

Semiconductor device and method of forming mold underfill using dis...

Integrated circuit packaging system with thermal dispersal structur...

Semiconductor device and method of forming mold underfill using dis...

Semiconductor device and method of forming mold underfill using dis...

Integrated circuit package system flip chip

Integrated circuit packaging system with interconnect and method of...

Integrated circuit package system with underfill

Patents Applicationslast 30 patents

Semiconductor Device and Method of Forming Mold Underfill Using Dis...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH THERMAL DISPERSAL STRUCTUR...

Semiconductor Device and Method of Forming Mold Underfill Using Dis...

Semiconductor Device and Method of Forming Mold Underfill Using Dis...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECT AND METHOD OF...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH POST TYPE INTERCONNECTOR A...

Semiconductor Substrate and Method of Forming Conformal Solder Wet-...

INTEGRATED CIRCUIT PACKAGE SYSTEM FLIP CHIP

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH UNDERFILL