Soon C. Lian

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
BGA mould assembly for encapsulating BGA substrates of varying thic...
- Patent number 5,989,471
- Issue date Nov 23, 1999
- Advanced Systems Automation Limited
- Tiang Siong Lian
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Bond wire configuration and injection mold for minimum wire sweep i...
- Patent number 5,155,578
- Issue date Oct 13, 1992
- Texas Instruments Incorporated
- Thiam B. Lim
- H01 - BASIC ELECTRIC ELEMENTS