Soon Gyu Yim

Person

Gyunggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer level package having cylindrical capacitor and method of fabr...
- Patent number 9,153,641
- Issue date Oct 6, 2015
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Seoup Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 8,866,288
- Issue date Oct 21, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jong Man Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same and sem...
- Patent number 8,786,064
- Issue date Jul 22, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jin Su Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of attaching die using self-assembling monolayer and package...
- Patent number 8,656,582
- Issue date Feb 25, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Seung Seoup Lee
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Apparatus and method for inspecting defects in circuit pattern of s...
- Patent number 8,471,581
- Issue date Jun 25, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Seung Seoup Lee
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package with a metal post and manufacturing method th...
- Patent number 8,409,981
- Issue date Apr 2, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Woon-Chun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package having cylindrical capacitor and method of fabr...
- Patent number 8,378,452
- Issue date Feb 19, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Seung Seoup Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency identification tag, and method of manufacturing the...
- Patent number 8,366,008
- Issue date Feb 5, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Woon Chun Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing a printed circuit board with an embedded el...
- Patent number 8,266,792
- Issue date Sep 18, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Woon-Chun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with a metal post
- Patent number 8,159,071
- Issue date Apr 17, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Woon-Chun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component embedded printed circuit board and manufacturi...
- Patent number 8,130,508
- Issue date Mar 6, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Woon-Chun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip package and printed circuit board
- Patent number 8,064,215
- Issue date Nov 22, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Yul-Kyo Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inspecting apparatus for semiconductor device
- Patent number 7,176,704
- Issue date Feb 13, 2007
- Samsung Electronics Co., Ltd.
- Je-hyoung Ryu
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
MEMS DEVICE PACKAGE
- Publication number 20150128697
- Publication date May 14, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Jong Man Kim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20140110830
- Publication date Apr 24, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jong Man Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Package Having Cylindrical Capacitor and Method Of Fabr...
- Publication number 20130147014
- Publication date Jun 13, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Seung Seoup Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME AND SEM...
- Publication number 20130105955
- Publication date May 2, 2013
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jin Su Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH A METAL POST AND MANUFACTURING METHOD TH...
- Publication number 20120164825
- Publication date Jun 28, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Woon-Chun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURI...
- Publication number 20120124828
- Publication date May 24, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Woon-Chun KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method of printed circuit board embedded chip
- Publication number 20120042513
- Publication date Feb 23, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Woon Chun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Display array substrate and method of manufacturing display substrate
- Publication number 20110128709
- Publication date Jun 2, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Woon Chun Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MOBILE PHONE
- Publication number 20110124382
- Publication date May 26, 2011
- Samsung Electro-Mechanics CO., LTD.
- Woon-Chun Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPARATUS AND METHOD FOR INSPECTING DEFECTS IN CIRCUIT PATTERN OF S...
- Publication number 20110115516
- Publication date May 19, 2011
- Seung Seoup Lee
- G01 - MEASURING TESTING
Information Patent Application
Display array substrate and method of manufacturing display substrate
- Publication number 20110061904
- Publication date Mar 17, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Woon Chun Kim
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
DYE-SENSITIZED SOLAR CELLS AND MOBILE DEVICE INCLUDING THE SAME
- Publication number 20110061727
- Publication date Mar 17, 2011
- Samsung Electro-Mechanics CO., LTD.
- Woon-Chun KIM
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
DYE-SENSITIZED SOLAR CELLS AND MOBILE DEVICE INCLUDING THE SAME
- Publication number 20110061707
- Publication date Mar 17, 2011
- Samsung Electro-Mechanics CO., LTD.
- Woon-Chun KIM
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Circuit board, semiconductor package and method of manufacturing th...
- Publication number 20110048778
- Publication date Mar 3, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Jong Woo Han
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
RADIO FREQUENCY IDENTIFICATION TAG, AND METHOD AND MOLD FOR MANUFAC...
- Publication number 20110043363
- Publication date Feb 24, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Woon Chun Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RADIO FREQUENCY IDENTIFICATION TAG, AND METHOD OF MANUFACTURING THE...
- Publication number 20110042466
- Publication date Feb 24, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Woon Chun KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WAFER LEVEL PACKAGE HAVING CYLINDRICAL CAPACITOR AND METHOD OF FABR...
- Publication number 20110037145
- Publication date Feb 17, 2011
- Seung Seoup LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER PROCESSING DEVICE
- Publication number 20100288739
- Publication date Nov 18, 2010
- Samsung Electro-Mechanics CO., LTD.
- Jae-Kwang Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100214719
- Publication date Aug 26, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Woon-Chun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ATTACHING DIE USING SELF-ASSEMBLING MONOLAYER AND PACKAGE...
- Publication number 20100187002
- Publication date Jul 29, 2010
- Seung Seoup Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD
- Publication number 20100140100
- Publication date Jun 10, 2010
- Samsung Electro-Mechanics CO., LTD.
- Woon-Chun KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITOR
- Publication number 20100142116
- Publication date Jun 10, 2010
- Samsung Electro-Mechanics CO., LTD.
- Woon-Chun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURI...
- Publication number 20100101847
- Publication date Apr 29, 2010
- Samsung Electro-Mechanics CO., LTD.
- Woon-Chun KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20100096749
- Publication date Apr 22, 2010
- Samsung Electro-Mechanics CO., LTD.
- Woon-Chun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100059881
- Publication date Mar 11, 2010
- Samsung Electro-Mechanics CO., LTD.
- Woon-Chun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD
- Publication number 20100051322
- Publication date Mar 4, 2010
- Samsung Electro-Mechanics CO., LTD.
- Woon-Chun KIM
- B32 - LAYERED PRODUCTS
Information Patent Application
Printed circuit board embedded chip and manufacturing method thereof
- Publication number 20090321118
- Publication date Dec 31, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Woon Chun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor chip package and printed circuit board
- Publication number 20090073667
- Publication date Mar 19, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Yul-Kyo Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System and method for testing semiconductor devices
- Publication number 20050012498
- Publication date Jan 20, 2005
- Soo-Chan Lee
- G01 - MEASURING TESTING
Information Patent Application
Inspecting apparatus for semiconductor device
- Publication number 20040263194
- Publication date Dec 30, 2004
- Samsung Electronics Co., Ltd.
- Je-hyoung Ryu
- G01 - MEASURING TESTING

Soon Gyu Yim

Person

Patents Grantslast 30 patents

Wafer level package having cylindrical capacitor and method of fabr...

Semiconductor package

Semiconductor package and method for manufacturing the same and sem...

Method of attaching die using self-assembling monolayer and package...

Apparatus and method for inspecting defects in circuit pattern of s...

Semiconductor package with a metal post and manufacturing method th...

Wafer level package having cylindrical capacitor and method of fabr...

Radio frequency identification tag, and method of manufacturing the...

Method of manufacturing a printed circuit board with an embedded el...

Semiconductor package with a metal post

Electronic component embedded printed circuit board and manufacturi...

Semiconductor chip package and printed circuit board

Inspecting apparatus for semiconductor device

Patents Applicationslast 30 patents

MEMS DEVICE PACKAGE

SEMICONDUCTOR PACKAGE

Wafer Level Package Having Cylindrical Capacitor and Method Of Fabr...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME AND SEM...

SEMICONDUCTOR PACKAGE WITH A METAL POST AND MANUFACTURING METHOD TH...

ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURI...

Manufacturing method of printed circuit board embedded chip

Display array substrate and method of manufacturing display substrate

MOBILE PHONE

APPARATUS AND METHOD FOR INSPECTING DEFECTS IN CIRCUIT PATTERN OF S...

Display array substrate and method of manufacturing display substrate

DYE-SENSITIZED SOLAR CELLS AND MOBILE DEVICE INCLUDING THE SAME

DYE-SENSITIZED SOLAR CELLS AND MOBILE DEVICE INCLUDING THE SAME

Circuit board, semiconductor package and method of manufacturing th...

RADIO FREQUENCY IDENTIFICATION TAG, AND METHOD AND MOLD FOR MANUFAC...

RADIO FREQUENCY IDENTIFICATION TAG, AND METHOD OF MANUFACTURING THE...

WAFER LEVEL PACKAGE HAVING CYLINDRICAL CAPACITOR AND METHOD OF FABR...

LASER PROCESSING DEVICE

CAPACITOR AND METHOD OF MANUFACTURING THE SAME

METHOD OF ATTACHING DIE USING SELF-ASSEMBLING MONOLAYER AND PACKAGE...

MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD

CAPACITOR

ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURI...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD

Printed circuit board embedded chip and manufacturing method thereof

Semiconductor chip package and printed circuit board

System and method for testing semiconductor devices

Inspecting apparatus for semiconductor device