Soon Ing Chew

Person

Milpitas, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having a baseplate with a die attach region a...
- Patent number 9,293,407
- Issue date Mar 22, 2016
- Infineon Technologies AG
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having asymmetric chip mounting area a...
- Patent number 9,209,116
- Issue date Dec 8, 2015
- Infineon Technologies AG
- Alexander Komposch
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
PCB based RF-power package window frame
- Patent number 8,907,467
- Issue date Dec 9, 2014
- Infineon Technologies AG
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flange for semiconductor die
- Patent number 8,604,609
- Issue date Dec 10, 2013
- Infineon Technologies AG
- Anwar A. Mohammed
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Flange for semiconductor die
- Patent number 8,314,487
- Issue date Nov 20, 2012
- Infineon Technologies AG
- Anwar A. Mohammed
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Open cavity leadless surface mountable package for high power RF ap...
- Patent number 8,110,915
- Issue date Feb 7, 2012
- Infineon Technologies AG
- Donald Fowlkes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power ceramic on copper package
- Patent number 8,110,445
- Issue date Feb 7, 2012
- Infineon Technologies AG
- Anwar A. Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air cavity package with copper heat sink and ceramic window frame
- Patent number 8,013,429
- Issue date Sep 6, 2011
- Infineon Technologies AG
- Anwar A. Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced electronic package
- Patent number 7,811,862
- Issue date Oct 12, 2010
- Infineon Technologies AG
- Anwar A. Mohammad
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING ASYMMETRIC CHIP MOUNTING AREA A...
- Publication number 20150340306
- Publication date Nov 26, 2015
- INFINEON TECHNOLOGIES AG
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PCB Based RF-Power Package Window Frame
- Publication number 20150048492
- Publication date Feb 19, 2015
- INFINEON TECHNOLOGIES AG
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PCB Based RF-Power Package Window Frame
- Publication number 20130256858
- Publication date Oct 3, 2013
- INFINEON TECHNOLOGIES NORTH AMERICA CORP.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flange for Semiconductor Die
- Publication number 20130037932
- Publication date Feb 14, 2013
- INFINEON TECHNOLOGIES AG
- Anwar A. Mohammed
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
Flange for Semiconductor Die
- Publication number 20110147921
- Publication date Jun 23, 2011
- Infineon Technologies North America Corp.
- Anwar A. Mohammed
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
Open Cavity Leadless Surface Mountable Package for High Power RF Ap...
- Publication number 20110089529
- Publication date Apr 21, 2011
- Infineon Technologies North America Corp.
- Donald Fowlkes
- H01 - BASIC ELECTRIC ELEMENTS

Soon Ing Chew

Person

Patents Grantslast 30 patents

Semiconductor package having a baseplate with a die attach region a...

Semiconductor device package having asymmetric chip mounting area a...

PCB based RF-power package window frame

Flange for semiconductor die

Flange for semiconductor die

Open cavity leadless surface mountable package for high power RF ap...

High power ceramic on copper package

Air cavity package with copper heat sink and ceramic window frame

Thermally enhanced electronic package

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE HAVING ASYMMETRIC CHIP MOUNTING AREA A...

PCB Based RF-Power Package Window Frame

PCB Based RF-Power Package Window Frame

Flange for Semiconductor Die

Flange for Semiconductor Die

Open Cavity Leadless Surface Mountable Package for High Power RF Ap...