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Soon Lee Liew
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Ipoh, MY
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Patents Grants
last 30 patents
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Patent Grant
Packaged semiconductor devices, and package molds for forming packa...
Patent number
12,119,239
Issue date
Oct 15, 2024
Wolfspeed, Inc.
Soon Lee Liew
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming packaged semiconductor devices and leadframes fo...
Patent number
12,009,286
Issue date
Jun 11, 2024
MACOM Technology Solutions Holdings, Inc.
Soon Lee Liew
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with air cavity
Patent number
10,777,536
Issue date
Sep 15, 2020
Infineon Technologies AG
Chau Fatt Chiang
B81 - MICRO-STRUCTURAL TECHNOLOGY
Patents Applications
last 30 patents
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Patent Application
METHODS OF FORMING PACKAGED SEMICONDUCTOR DEVICES AND LEADFRAMES FO...
Publication number
20240282679
Publication date
Aug 22, 2024
MACOM Technology Solutions Holdings, Inc.
Soon Lee Liew
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TRANSISTOR PACKAGE AND PROCESS OF IMPLEMENTING THE TRANSISTOR PACKAGE
Publication number
20240105570
Publication date
Mar 28, 2024
WOLFSPEED, INC.
Eng Wah WOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGES WITH EXPOSED HEAT DISSIPATING SURFACE...
Publication number
20230421119
Publication date
Dec 28, 2023
Wolfspeed, Inc.
Alexander Komposch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF FORMING PACKAGED SEMICONDUCTOR DEVICES, PACKAGED SEMICON...
Publication number
20230162991
Publication date
May 25, 2023
Wolfspeed, Inc.
Soon Lee Liew
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF FORMING PACKAGED SEMICONDUCTOR DEVICES AND LEADFRAMES FO...
Publication number
20230117260
Publication date
Apr 20, 2023
Wolfspeed, Inc.
Soon Lee Liew
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package with Air Cavity
Publication number
20190181120
Publication date
Jun 13, 2019
INFINEON TECHNOLOGIES AG
Chau Fatt Chiang
H01 - BASIC ELECTRIC ELEMENTS