Soon-Shin Chee

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package and methods of manufacturing the same
- Patent number 8,178,962
- Issue date May 15, 2012
- Xilinx, Inc.
- Soon-Shin Chee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit
- Patent number 7,880,265
- Issue date Feb 1, 2011
- Xilinx, Inc.
- Soon-Shin Chee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power plane and land pad feature to prevent human metal electrostat...
- Patent number 7,872,346
- Issue date Jan 18, 2011
- Xilinx, Inc.
- Soon Shin Chee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for a power distribution system
- Patent number 7,605,460
- Issue date Oct 20, 2009
- Xilinx, Inc.
- Paul Ying-Fung Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lid and method of employing a lid on an integrated circuit
- Patent number 7,429,501
- Issue date Sep 30, 2008
- Xilinx, Inc.
- Paul Ying-Fung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with improved return loss
- Patent number 7,294,904
- Issue date Nov 13, 2007
- Xilinx, Inc.
- Soon-Shin Chee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit and method of producing a carrier wafer for an i...
- Patent number 7,098,075
- Issue date Aug 29, 2006
- Xilinx, Inc.
- Soon-Shin Chee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid and method of employing a lid on an integrated circuit
- Patent number 7,012,326
- Issue date Mar 14, 2006
- Xilinx, Inc.
- Paul Ying-Fung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array chip capacitor structure
- Patent number 6,657,133
- Issue date Dec 2, 2003
- Xilinx, Inc.
- Soon S. Chee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Package enclosing multiple packaged chips
- Publication number 20030089977
- Publication date May 15, 2003
- Xilinx, Inc.
- Soon-Shin Chee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Soon-Shin Chee

Person

Patents Grantslast 30 patents

Semiconductor device package and methods of manufacturing the same

Packaged integrated circuit

Power plane and land pad feature to prevent human metal electrostat...

Method and apparatus for a power distribution system

Lid and method of employing a lid on an integrated circuit

Integrated circuit package with improved return loss

Integrated circuit and method of producing a carrier wafer for an i...

Lid and method of employing a lid on an integrated circuit

Ball grid array chip capacitor structure

Patents Applicationslast 30 patents

Package enclosing multiple packaged chips