Soon Wei WANG

Person

Seremban, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with wettable flank and related methods
- Patent number 12,243,810
- Issue date Mar 4, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Hui Min Ler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with wettable flank
- Patent number 12,176,272
- Issue date Dec 24, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Hui Min Ler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die sidewall coatings and related methods
- Patent number 12,040,192
- Issue date Jul 16, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with die including cavities
- Patent number 11,908,699
- Issue date Feb 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backmetal removal methods
- Patent number 11,901,184
- Issue date Feb 13, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with die support structure for thin die
- Patent number 11,894,234
- Issue date Feb 6, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin multichip power devices
- Patent number 11,721,654
- Issue date Aug 8, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Nurul Nadiah Manap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with wettable flank
- Patent number 11,532,539
- Issue date Dec 20, 2022
- Semiconductor Components Industries, LLC
- Hui Min Ler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer resin and compression mold chip scale package
- Patent number 11,508,679
- Issue date Nov 22, 2022
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with thin die and related methods
- Patent number 11,404,276
- Issue date Aug 2, 2022
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die sidewall coatings and related methods
- Patent number 11,404,277
- Issue date Aug 2, 2022
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon-on-insulator die support structures and related methods
- Patent number 11,361,970
- Issue date Jun 14, 2022
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backmetal removal methods
- Patent number 11,348,796
- Issue date May 31, 2022
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with die including cavities and related methods
- Patent number 11,342,189
- Issue date May 24, 2022
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor package
- Patent number 10,971,429
- Issue date Apr 6, 2021
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin multichip power devices
- Patent number 10,930,604
- Issue date Feb 23, 2021
- Semiconductor Components Industries, LLC
- Nurul Nadiah Manap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded wafer level packaging
- Patent number 10,916,485
- Issue date Feb 9, 2021
- Semiconductor Components Industries, LLC
- Soon Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer resin and compression mold chip scale package
- Patent number 10,825,786
- Issue date Nov 3, 2020
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat no leads package with locking feature
- Patent number 10,825,754
- Issue date Nov 3, 2020
- Semiconductor Components Industries, LLC
- Soon Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless semiconductor packages, leadframes therefor, and methods o...
- Patent number 10,756,006
- Issue date Aug 25, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,607,920
- Issue date Mar 31, 2020
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor package
- Patent number 10,607,921
- Issue date Mar 31, 2020
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded wafer level packaging
- Patent number 10,559,510
- Issue date Feb 11, 2020
- Semiconductor Components Industries, LLC
- Soon Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip packages with stabilized die pads
- Patent number 10,438,877
- Issue date Oct 8, 2019
- Semiconductor Components Industries, LLC
- Jose Felixminia Palagud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer resin and compression mold chip scale package
- Patent number 10,283,466
- Issue date May 7, 2019
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless semiconductor packages, leadframes therefor, and methods o...
- Patent number 10,199,311
- Issue date Feb 5, 2019
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible semiconductor package
- Patent number 10,177,074
- Issue date Jan 8, 2019
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die support for enlarging die size
- Patent number 9,748,163
- Issue date Aug 29, 2017
- Semiconductor Components Industries, LLC
- Soon Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale packages and related methods
- Patent number 9,281,258
- Issue date Mar 8, 2016
- Semiconductor Components Industries, LLC
- Bih Wen Fon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method of manufacture
- Patent number 8,451,621
- Issue date May 28, 2013
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
IMAGE SENSOR PACKAGES AND RELATED METHODS
- Publication number 20250081647
- Publication date Mar 6, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Soon Wei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SIDEWALL COATINGS AND RELATED METHODS
- Publication number 20240332025
- Publication date Oct 3, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING WETTABLE FLANKS AND RELATED METHODS
- Publication number 20240332135
- Publication date Oct 3, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Soon Wei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH DIE INCLUDING CAVITIES AND RELATED METHODS
- Publication number 20240203744
- Publication date Jun 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK
- Publication number 20230073330
- Publication date Mar 9, 2023
- Semiconductor Components Industries, LLC
- Hui Min LER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK AND RELATED METHODS
- Publication number 20230073773
- Publication date Mar 9, 2023
- Semiconductor Components Industries, LLC
- Hui Min LER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SIDEWALL COATINGS AND RELATED METHODS
- Publication number 20220351977
- Publication date Nov 3, 2022
- Semiconductor Components Industries, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH THIN DIE AND RELATED METHODS
- Publication number 20220351978
- Publication date Nov 3, 2022
- Semiconductor Components Industries, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON-ON-INSULATOR DIE SUPPORT STRUCTURES AND RELATED METHODS
- Publication number 20220301876
- Publication date Sep 22, 2022
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH DIE INCLUDING CAVITIES AND RELATED METHODS
- Publication number 20220246434
- Publication date Aug 4, 2022
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKMETAL REMOVAL METHODS
- Publication number 20220238342
- Publication date Jul 28, 2022
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK AND RELATED METHODS
- Publication number 20220208658
- Publication date Jun 30, 2022
- Semiconductor Components Industries, LLC
- Hui Min LER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN MULTICHIP POWER DEVICES
- Publication number 20210183799
- Publication date Jun 17, 2021
- Semiconductor Components Industries, LLC
- Nurul Nadiah MANAP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUAD FLAT NO LEADS PACKAGE WITH LOCKING FEATURE
- Publication number 20210043550
- Publication date Feb 11, 2021
- Semiconductor Components Industries, LLC
- Soon Wei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMER RESIN AND COMPRESSION MOLD CHIP SCALE PACKAGE
- Publication number 20210028133
- Publication date Jan 28, 2021
- Semiconductor Components Industries, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS O...
- Publication number 20200365494
- Publication date Nov 19, 2020
- Semiconductor Components Industries, LLC
- Darrell D. TRUHITTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH DIE INCLUDING CAVITIES AND RELATED METHODS
- Publication number 20200365408
- Publication date Nov 19, 2020
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKMETAL REMOVAL METHODS
- Publication number 20200286736
- Publication date Sep 10, 2020
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH THIN DIE AND RELATED METHODS
- Publication number 20200286735
- Publication date Sep 10, 2020
- Semiconductor Components Industries, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SIDEWALL COATINGS AND RELATED METHODS
- Publication number 20200279747
- Publication date Sep 3, 2020
- Semiconductor Components Industries, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SUPPORT STRUCTURES AND RELATED METHODS
- Publication number 20200258750
- Publication date Aug 13, 2020
- Semiconductor Components Industries, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON-ON-INSULATOR DIE SUPPORT STRUCTURES AND RELATED METHODS
- Publication number 20200258751
- Publication date Aug 13, 2020
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR PACKAGE
- Publication number 20200194340
- Publication date Jun 18, 2020
- Semiconductor Components Industries, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED WAFER LEVEL PACKAGING
- Publication number 20200126880
- Publication date Apr 23, 2020
- Semiconductor Components Industries, LLC
- Soon Wei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-LEAD SEMICONDUCTOR DEVICE PACKAGES WITH ELECTRICALLY ISOLAT...
- Publication number 20200035586
- Publication date Jan 30, 2020
- Semiconductor Components Industries, LLC
- Jin Yoong LIONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN MULTICHIP POWER DEVICES
- Publication number 20190304940
- Publication date Oct 3, 2019
- Semiconductor Components Industries, LLC
- Nurul Nadiah MANAP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGES WITH STABILIZED DIE PADS
- Publication number 20190287884
- Publication date Sep 19, 2019
- Semiconductor Components Industries, LLC
- Jose Felixminia PALAGUD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMER RESIN AND COMPRESSION MOLD CHIP SCALE PACKAGE
- Publication number 20190221532
- Publication date Jul 18, 2019
- Semiconductor Components Industries, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS O...
- Publication number 20190122967
- Publication date Apr 25, 2019
- Semiconductor Components Industries, LLC
- Darrell D. TRUHITTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20190103338
- Publication date Apr 4, 2019
- Semiconductor Components Industries, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS

Soon Wei WANG

Person

Patents Grantslast 30 patents

Semiconductor package with wettable flank and related methods

Semiconductor package with wettable flank

Die sidewall coatings and related methods

Semiconductor packages with die including cavities

Backmetal removal methods

Semiconductor packages with die support structure for thin die

Ultra-thin multichip power devices

Semiconductor package with wettable flank

Polymer resin and compression mold chip scale package

Semiconductor packages with thin die and related methods

Die sidewall coatings and related methods

Silicon-on-insulator die support structures and related methods

Backmetal removal methods

Semiconductor packages with die including cavities and related methods

Method for forming a semiconductor package

Ultra-thin multichip power devices

Molded wafer level packaging

Polymer resin and compression mold chip scale package

Quad flat no leads package with locking feature

Leadless semiconductor packages, leadframes therefor, and methods o...

Semiconductor package

Method for forming a semiconductor package

Molded wafer level packaging

Multi-chip packages with stabilized die pads

Polymer resin and compression mold chip scale package

Leadless semiconductor packages, leadframes therefor, and methods o...

Flexible semiconductor package

Die support for enlarging die size

Chip scale packages and related methods

Semiconductor component and method of manufacture

Patents Applicationslast 30 patents

IMAGE SENSOR PACKAGES AND RELATED METHODS

DIE SIDEWALL COATINGS AND RELATED METHODS

SEMICONDUCTOR PACKAGE HAVING WETTABLE FLANKS AND RELATED METHODS

SEMICONDUCTOR PACKAGES WITH DIE INCLUDING CAVITIES AND RELATED METHODS

SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK

SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK AND RELATED METHODS

DIE SIDEWALL COATINGS AND RELATED METHODS

SEMICONDUCTOR PACKAGES WITH THIN DIE AND RELATED METHODS

SILICON-ON-INSULATOR DIE SUPPORT STRUCTURES AND RELATED METHODS

SEMICONDUCTOR PACKAGES WITH DIE INCLUDING CAVITIES AND RELATED METHODS

BACKMETAL REMOVAL METHODS

SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK AND RELATED METHODS

ULTRA-THIN MULTICHIP POWER DEVICES

QUAD FLAT NO LEADS PACKAGE WITH LOCKING FEATURE

POLYMER RESIN AND COMPRESSION MOLD CHIP SCALE PACKAGE

LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS O...

SEMICONDUCTOR PACKAGES WITH DIE INCLUDING CAVITIES AND RELATED METHODS

BACKMETAL REMOVAL METHODS

SEMICONDUCTOR PACKAGES WITH THIN DIE AND RELATED METHODS

DIE SIDEWALL COATINGS AND RELATED METHODS

DIE SUPPORT STRUCTURES AND RELATED METHODS

SILICON-ON-INSULATOR DIE SUPPORT STRUCTURES AND RELATED METHODS

METHOD FOR FORMING A SEMICONDUCTOR PACKAGE

MOLDED WAFER LEVEL PACKAGING

CHIP-ON-LEAD SEMICONDUCTOR DEVICE PACKAGES WITH ELECTRICALLY ISOLAT...

ULTRA-THIN MULTICHIP POWER DEVICES

MULTI-CHIP PACKAGES WITH STABILIZED DIE PADS

POLYMER RESIN AND COMPRESSION MOLD CHIP SCALE PACKAGE

LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS O...

FLEXIBLE SEMICONDUCTOR PACKAGE AND RELATED METHODS