Sophie Verrun

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Grenoble, FR

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Patents Grantslast 30 patents

Information Patent Grant
Assembly of a wire element with a microelectronic chip with a groov...
- Patent number 8,723,312
- Issue date May 13, 2014
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean Brun
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Assembly of a microelectronic chip having a groove with a wire elem...
- Patent number 8,611,101
- Issue date Dec 17, 2013
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean Brun
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
3D integration of vertical components in reconstituted substrates
- Patent number 8,039,306
- Issue date Oct 18, 2011
- Commissariat a l'Energie Atomique
- François Baleras
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
ASSEMBLY OF A MICROELECTRONIC CHIP HAVING A GROOVE WITH A WIRE ELEM...
- Publication number 20110198735
- Publication date Aug 18, 2011
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Jean Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY OF A WIRE ELEMENT WITH A MICROELECTRONIC CHIP WITH A GROOV...
- Publication number 20110001237
- Publication date Jan 6, 2011
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Jean Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATION OF VERTICAL COMPONENTS IN RECONSTITUTED SUBSTRATES
- Publication number 20100181679
- Publication date Jul 22, 2010
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Francois Baleras
- B81 - MICRO-STRUCTURAL TECHNOLOGY