Sotaro Ito

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Gifu, JP

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Patents Grantslast 30 patents

Information Patent Grant
Multilayered printed circuit board and method for manufacturing the...
- Patent number 9,027,238
- Issue date May 12, 2015
- Ibiden Co., Ltd.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a multilayered circuit board
- Patent number 8,973,259
- Issue date Mar 10, 2015
- Ibiden Co., Ltd.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered printed circuit board and method for manufacturing the...
- Patent number 8,912,451
- Issue date Dec 16, 2014
- Ibiden Co., Ltd.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed circuit board
- Patent number 8,705,248
- Issue date Apr 22, 2014
- Ibiden Co., Ltd.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered printed circuit board and method for manufacturing the...
- Patent number 8,692,132
- Issue date Apr 8, 2014
- Ibiden Co., Ltd.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 8,373,073
- Issue date Feb 12, 2013
- Ibiden Co., Ltd.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed circuit board
- Patent number 8,320,135
- Issue date Nov 27, 2012
- Ibiden Co., Ltd.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board with concave portion for accomodating elect...
- Patent number 8,168,893
- Issue date May 1, 2012
- Ibiden, Co., Ltd.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered printed circuit board and method for manufacturing the...
- Patent number 8,101,868
- Issue date Jan 24, 2012
- Ibiden Co., Ltd.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed circuit board
- Patent number 7,957,154
- Issue date Jun 7, 2011
- Ibiden Co., Ltd.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayer printed circuit board
- Patent number 7,929,313
- Issue date Apr 19, 2011
- Ibiden Co., Ltd.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD AND THE MANUFACTURING METHOD THEREOF
- Publication number 20130033837
- Publication date Feb 7, 2013
- Sotaro Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE...
- Publication number 20120106108
- Publication date May 3, 2012
- IBIDEN CO., LTD.
- Sotaro ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE...
- Publication number 20120077317
- Publication date Mar 29, 2012
- IBIDEN CO., LTD.
- Sotaro ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE...
- Publication number 20120006587
- Publication date Jan 12, 2012
- IBIDEN CO., LTD.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE...
- Publication number 20110314668
- Publication date Dec 29, 2011
- IBIDEN CO., LTD.
- Sotaro ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD AND THE MANUFACTURING METHOD THEREOF
- Publication number 20110176284
- Publication date Jul 21, 2011
- IBIDEN CO., LTD.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100300738
- Publication date Dec 2, 2010
- IBIDEN, CO., LTD.
- Sotaro ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD AND THE MANUFACTURING METHOD THEREOF
- Publication number 20100159647
- Publication date Jun 24, 2010
- IBIDEN CO., LTD.
- Sotaro ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090188703
- Publication date Jul 30, 2009
- IBIDEN CO., LTD.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND THE MANUFACTURING METHOD THE...
- Publication number 20080007927
- Publication date Jan 10, 2008
- IBIDEN CO., LTD.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayered printed circuit board and method for manufacturing the...
- Publication number 20070095471
- Publication date May 3, 2007
- IBIDEN CO., LTD.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Multilayered printed circuit board and method for manufacturing the...

Method for manufacturing a multilayered circuit board

Multilayered printed circuit board and method for manufacturing the...

Multilayer printed circuit board

Multilayered printed circuit board and method for manufacturing the...

Wiring board and method for manufacturing the same

Multilayer printed circuit board

Multilayer wiring board with concave portion for accomodating elect...

Multilayered printed circuit board and method for manufacturing the...

Multilayer printed circuit board

Method of manufacturing multilayer printed circuit board

Patents Applicationslast 30 patents

MULTILAYER PRINTED CIRCUIT BOARD AND THE MANUFACTURING METHOD THEREOF

MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE...

MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE...

MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE...

MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE...

MULTILAYER PRINTED CIRCUIT BOARD AND THE MANUFACTURING METHOD THEREOF

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

MULTILAYER PRINTED CIRCUIT BOARD AND THE MANUFACTURING METHOD THEREOF

MULTILAYER WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

MULTILAYERED PRINTED CIRCUIT BOARD AND THE MANUFACTURING METHOD THE...

Multilayered printed circuit board and method for manufacturing the...