Souichi Asakawa

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Device for polishing peripheral edge of semiconductor wafer
- Patent number 8,029,333
- Issue date Oct 4, 2011
- Ebara Corporation
- Tamami Takahashi
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
DEVICE FOR AND METHOD OF POLISHING PERIPHERAL EDGE OF SEMICONDUCTOR...
- Publication number 20090093192
- Publication date Apr 9, 2009
- EBARA CORPORATION
- Tamami Takahashi
- B24 - GRINDING POLISHING