Souichi MATSUBARA

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Grinding apparatus
- Patent number 11,524,386
- Issue date Dec 13, 2022
- Disco Corporation
- Souichi Matsubara
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer grinding method
- Patent number 11,491,610
- Issue date Nov 8, 2022
- Disco Corporation
- Hiroshi Shibata
- B24 - GRINDING POLISHING
Information Patent Grant
Processing apparatus
- Patent number 11,389,927
- Issue date Jul 19, 2022
- Disco Corporation
- Nobuyuki Fukushi
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF GRINDING SUBSTRATE
- Publication number 20210101252
- Publication date Apr 8, 2021
- Disco Corporation
- Hiroshi KUROKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING WORKPIECE
- Publication number 20200398400
- Publication date Dec 24, 2020
- Disco Corporation
- Souichi MATSUBARA
- B24 - GRINDING POLISHING
Information Patent Application
GRINDING APPARATUS
- Publication number 20200316750
- Publication date Oct 8, 2020
- Disco Corporation
- Souichi MATSUBARA
- B24 - GRINDING POLISHING
Information Patent Application
GRINDING APPARATUS
- Publication number 20200262029
- Publication date Aug 20, 2020
- Disco Corporation
- Shungo YOSHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING APPARATUS
- Publication number 20190351525
- Publication date Nov 21, 2019
- Disco Corporation
- Nobuyuki FUKUSHI
- B24 - GRINDING POLISHING
Information Patent Application
WAFER GRINDING METHOD
- Publication number 20190291240
- Publication date Sep 26, 2019
- Toyota Jidosha Kabushiki Kaisha
- Hiroshi SHIBATA
- B24 - GRINDING POLISHING