Souichirou KOMIYA

Follow

Person

Chiyoda-ku, Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Reactive hot-melt adhesive composition, and bonded body and method...
- Patent number 12,043,774
- Issue date Jul 23, 2024
- Resonac Corporation
- Chika Kuramochi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Moisture-curable reactive hot-melt adhesive composition and method...
- Patent number 11,624,016
- Issue date Apr 11, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Chika Kuramochi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
MOISTURE-CURABLE HOT-MELT ADHESIVE COMPOSITION, BONDED OBJECT, AND...
- Publication number 20220204826
- Publication date Jun 30, 2022
- Showa Denko Materials Co., Ltd.
- Shujie QU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
REACTIVE HOT-MELT ADHESIVE COMPOSITION, AND BONDED BODY AND METHOD...
- Publication number 20220112405
- Publication date Apr 14, 2022
- Showa Denko Materials Co., Ltd.
- Chika KURAMOCHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MOISTURE-CURABLE REACTIVE HOT-MELT ADHESIVE COMPOSITION AND METHOD...
- Publication number 20190127618
- Publication date May 2, 2019
- Hitachi Chemical Company, Ltd.
- Chika KURAMOCHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...