SOYEON KWON

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,218,096
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE IN A STACK FORM
- Publication number 20240387420
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Soyeon Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321667
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Seunghun Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SEMICONDUCTOR DEVICES
- Publication number 20240213109
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP SPLITTING METHOD USING A LASER AND SEMICONDUCTOR...
- Publication number 20240157481
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- YEONGKWON KO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20230048729
- Publication date Feb 16, 2023
- Samsung Electronics Co., Ltd.
- YEONGKWON KO
- H01 - BASIC ELECTRIC ELEMENTS