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Hwaseong-si, KR
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor package
Patent number
11,791,308
Issue date
Oct 17, 2023
Samsung Electronics Co., Ltd.
Jihwan Hwang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including underfill material layer and method...
Patent number
11,764,192
Issue date
Sep 19, 2023
Samsung Electronics Co., Ltd.
Jihwan Hwang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having stacked semiconductor chips
Patent number
11,721,673
Issue date
Aug 8, 2023
Samsung Electronics Co., Ltd.
Hyuekjae Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including underfill material layer and method...
Patent number
11,404,395
Issue date
Aug 2, 2022
Samsung Electronics Co., Ltd.
Jihwan Hwang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
11,362,062
Issue date
Jun 14, 2022
Samsung Electronics Co., Ltd.
Jihwan Hwang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having stacked semiconductor chips
Patent number
11,244,927
Issue date
Feb 8, 2022
Samsung Electronics Co., Ltd.
Hyuekjae Lee
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL MATERIAL LAYER AND METHOD...
Publication number
20220344308
Publication date
Oct 27, 2022
Samsung Electronics Co., Ltd.
Jihwan HWANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20220285312
Publication date
Sep 8, 2022
Samsung Electronics Co., Ltd.
Jihwan HWANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE HAVING STACKED SEMICONDUCTOR CHIPS
Publication number
20220130801
Publication date
Apr 28, 2022
Samsung Electronics Co., Ltd.
Hyuekjae LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20210375823
Publication date
Dec 2, 2021
Samsung Electronics Co., Ltd.
Jihwan HWANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL MATERIAL LAYER AND METHOD...
Publication number
20210151410
Publication date
May 20, 2021
Samsung Electronics Co., Ltd.
Jihwan HWANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE HAVING STACKED SEMICONDUCTOR CHIPS
Publication number
20210028152
Publication date
Jan 28, 2021
Samsung Electronics Co., Ltd.
Hyuekjae LEE
H01 - BASIC ELECTRIC ELEMENTS