Soyoung LIM

Person

Hwaseong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Package substrate film and semiconductor package including the same
- Patent number 11,862,548
- Issue date Jan 2, 2024
- Samsung Electronics Co., Ltd.
- Kyoungsuk Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film product, film packages and package modules using the same
- Patent number 10,304,764
- Issue date May 28, 2019
- Samsung Electronics Co., Ltd.
- Yechung Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film for semiconductor package, semiconductor package using film an...
- Patent number 9,922,891
- Issue date Mar 20, 2018
- Samsung Electronics Co., Ltd.
- Soyoung Lim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Film for semiconductor package, semiconductor package using film an...
- Patent number 9,576,865
- Issue date Feb 21, 2017
- Samsung Electronics Co., Ltd.
- Soyoung Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus
- Patent number 9,313,889
- Issue date Apr 12, 2016
- Samsung Electronics Co., Ltd.
- Kyoungsuk Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating semiconductor package having substrate with s...
- Patent number 8,828,795
- Issue date Sep 9, 2014
- Samsung Electronics Co., Ltd.
- Sang-Gui Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having substrate with solder ball connections...
- Patent number 8,304,892
- Issue date Nov 6, 2012
- Samsung Electronics Co., Ltd.
- Sang-Gui Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including heat slugs
- Patent number 8,269,342
- Issue date Sep 18, 2012
- Samsung Electronics Co., Ltd.
- Yonghoon Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND PACKAGE MODULE INCLUDING THE SAME
- Publication number 20240014221
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- SOYOUNG LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE FILM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20220173026
- Publication date Jun 2, 2022
- Samsung Electronics Co., Ltd.
- Kyoungsuk YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM PRODUCT, FILM PACKAGES AND PACKAGE MODULES USING THE SAME
- Publication number 20170372992
- Publication date Dec 28, 2017
- Samsung Electronics Co., Ltd.
- Yechung CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE USING FILM AN...
- Publication number 20170125314
- Publication date May 4, 2017
- Samsung Electronics Co., Ltd.
- Soyoung LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE USING FILM AN...
- Publication number 20160197020
- Publication date Jul 7, 2016
- Samsung Electronics Co., Ltd.
- Soyoung LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS
- Publication number 20140328031
- Publication date Nov 6, 2014
- Samsung Electronics Co., Ltd.
- KYOUNGSUK YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20130005092
- Publication date Jan 3, 2013
- Sang Gui Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor packages including heat slugs
- Publication number 20110018119
- Publication date Jan 27, 2011
- SAMSUNG ELECTRONICS CO., LTD.
- Yonghoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20100314760
- Publication date Dec 16, 2010
- Sang Gui Jo
- H01 - BASIC ELECTRIC ELEMENTS

Soyoung LIM

Person

Patents Grantslast 30 patents

Package substrate film and semiconductor package including the same

Film product, film packages and package modules using the same

Film for semiconductor package, semiconductor package using film an...

Film for semiconductor package, semiconductor package using film an...

Display apparatus

Method of fabricating semiconductor package having substrate with s...

Semiconductor package having substrate with solder ball connections...

Semiconductor packages including heat slugs

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND PACKAGE MODULE INCLUDING THE SAME

PACKAGE SUBSTRATE FILM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

FILM PRODUCT, FILM PACKAGES AND PACKAGE MODULES USING THE SAME

FILM FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE USING FILM AN...

FILM FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE USING FILM AN...

DISPLAY APPARATUS

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

Semiconductor packages including heat slugs

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME