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Spyridon Galis
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Hopewell Junction, NY, US
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Patents Grants
last 30 patents
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Patent Grant
Hybrid bonding interface for 3-dimensional chip integration
Patent number
8,349,729
Issue date
Jan 8, 2013
International Business Machines Corporation
Karl W. Barth
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Hybrid bonding interface for 3-dimensional chip integration
Patent number
8,159,060
Issue date
Apr 17, 2012
International Business Machines Corporation
Karl W. Barth
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
HYBRID BONDING INTERFACE FOR 3-DIMENSIONAL CHIP INTEGRATION
Publication number
20120171818
Publication date
Jul 5, 2012
International Business Machines Corporation
Karl W. Barth
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
HYBRID BONDING INTERFACE FOR 3-DIMENSIONAL CHIP INTEGRATION
Publication number
20110101537
Publication date
May 5, 2011
International Business Machines Corporation
Karl W. Barth
H01 - BASIC ELECTRIC ELEMENTS