Sree KESAPRAGADA

Person

Union City, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods and apparatus for cleaving of semiconductor substrates
- Patent number 11,610,807
- Issue date Mar 21, 2023
- Applied Materials, Inc.
- Felix Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for cleaving of semiconductor substrates
- Patent number 11,569,122
- Issue date Jan 31, 2023
- Applied Materials, Inc.
- Felix Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for cleaving of semiconductor substrates
- Patent number 10,991,617
- Issue date Apr 27, 2021
- Applied Materials, Inc.
- Felix Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for asymmetric selective physical vapor deposi...
- Patent number 10,815,561
- Issue date Oct 27, 2020
- Applied Materials, Inc.
- Joung Joo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for depositing cobalt in a feature
- Patent number 10,714,388
- Issue date Jul 14, 2020
- Applied Materials, Inc.
- Jin Hee Park
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for depositing dielectric barrier layers and aluminum conta...
- Patent number 10,707,122
- Issue date Jul 7, 2020
- Applied Materials, Inc.
- Sree Rangasai V. Kesapragada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of cobalt films with high deposition rate
- Patent number 10,559,578
- Issue date Feb 11, 2020
- Applied Materials, Inc.
- Jacqueline S. Wrench
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for depositing cobalt in a feature
- Patent number 10,157,787
- Issue date Dec 18, 2018
- Applied Materials, Inc.
- Jin Hee Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for depositing dielectric barrier layers and aluminum conta...
- Patent number 10,109,520
- Issue date Oct 23, 2018
- Applied Materials, Inc.
- Sree Rangasai V. Kesapragada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of formation
- Patent number 9,984,976
- Issue date May 29, 2018
- Applied Materials, Inc.
- Yana Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric/metal barrier integration to prevent copper diffusion
- Patent number 9,601,431
- Issue date Mar 21, 2017
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming passivation protection for an interconnection s...
- Patent number 9,299,605
- Issue date Mar 29, 2016
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Methods and Apparatus for Cleaving of Semiconductor Substrates
- Publication number 20210233802
- Publication date Jul 29, 2021
- Applied Materials, Inc.
- FELIX DENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR CLEAVING OF SEMICONDUCTOR SUBSTRATES
- Publication number 20210217656
- Publication date Jul 15, 2021
- Applied Materials, Inc.
- FELIX DENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR PATTERNING SUBSTRATES USING ASYMMETRIC PH...
- Publication number 20200135464
- Publication date Apr 30, 2020
- Applied Materials, Inc.
- SREE RANGASAI V. KESAPRAGADA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND APPARATUS FOR CLEAVING OF SEMICONDUCTOR SUBSTRATES
- Publication number 20190355616
- Publication date Nov 21, 2019
- Applied Materials, Inc.
- FELIX DENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS OF FORMING STRUCTURES BY SYMMETRIC SELECTIVE P...
- Publication number 20190287772
- Publication date Sep 19, 2019
- Applied Materials, Inc.
- JOUNG JOO LEE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND APPARATUS FOR ASYMMETRIC SELECTIVE PHYSICAL VAPOR DEPOSI...
- Publication number 20190276926
- Publication date Sep 12, 2019
- Joung Joo Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND APPARATUS FOR DEPOSITING COBALT IN A FEATURE
- Publication number 20190122924
- Publication date Apr 25, 2019
- Applied Materials, Inc.
- Jin Hee PARK
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR DEPOSITING DIELECTRIC BARRIER LAYERS AND ALUMINUM CONTA...
- Publication number 20190027403
- Publication date Jan 24, 2019
- Applied Materials, Inc.
- Sree Rangasai V. KESAPRAGADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Deposition Of Cobalt Films With High Deposition Rate
- Publication number 20180350826
- Publication date Dec 6, 2018
- Applied Materials, Inc.
- Jacqueline S. Wrench
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR DEPOSITING COBALT IN A FEATURE
- Publication number 20170178956
- Publication date Jun 22, 2017
- Applied Materials, Inc.
- Jin Hee PARK
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR DEPOSITING DIELECTRIC BARRIER LAYERS AND ALUMINUM CONTA...
- Publication number 20170098575
- Publication date Apr 6, 2017
- Applied Materials, Inc.
- Sree Rangasai V. KESAPRAGADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES AND METHODS OF FORMATION
- Publication number 20160240483
- Publication date Aug 18, 2016
- Applied Materials, Inc.
- YANA CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING PASSIVATION PROTECTION FOR AN INTERCONNECTION S...
- Publication number 20150255329
- Publication date Sep 10, 2015
- Applied Materials, Inc.
- He REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC/METAL BARRIER INTEGRATION TO PREVENT COPPER DIFFUSION
- Publication number 20150221596
- Publication date Aug 6, 2015
- Applied Materials, Inc.
- He REN
- H01 - BASIC ELECTRIC ELEMENTS

Sree KESAPRAGADA

Person

Patents Grantslast 30 patents

Methods and apparatus for cleaving of semiconductor substrates

Methods and apparatus for cleaving of semiconductor substrates

Methods and apparatus for cleaving of semiconductor substrates

Method and apparatus for asymmetric selective physical vapor deposi...

Method and apparatus for depositing cobalt in a feature

Methods for depositing dielectric barrier layers and aluminum conta...

Deposition of cobalt films with high deposition rate

Method and apparatus for depositing cobalt in a feature

Methods for depositing dielectric barrier layers and aluminum conta...

Interconnect structures and methods of formation

Dielectric/metal barrier integration to prevent copper diffusion

Methods for forming passivation protection for an interconnection s...

Patents Applicationslast 30 patents

Methods and Apparatus for Cleaving of Semiconductor Substrates

METHODS AND APPARATUS FOR CLEAVING OF SEMICONDUCTOR SUBSTRATES

METHODS AND APPARATUS FOR PATTERNING SUBSTRATES USING ASYMMETRIC PH...

METHODS AND APPARATUS FOR CLEAVING OF SEMICONDUCTOR SUBSTRATES

METHOD AND APPARATUS OF FORMING STRUCTURES BY SYMMETRIC SELECTIVE P...

METHOD AND APPARATUS FOR ASYMMETRIC SELECTIVE PHYSICAL VAPOR DEPOSI...

METHOD AND APPARATUS FOR DEPOSITING COBALT IN A FEATURE

METHODS FOR DEPOSITING DIELECTRIC BARRIER LAYERS AND ALUMINUM CONTA...

Deposition Of Cobalt Films With High Deposition Rate

METHOD AND APPARATUS FOR DEPOSITING COBALT IN A FEATURE

METHODS FOR DEPOSITING DIELECTRIC BARRIER LAYERS AND ALUMINUM CONTA...

INTERCONNECT STRUCTURES AND METHODS OF FORMATION

METHODS FOR FORMING PASSIVATION PROTECTION FOR AN INTERCONNECTION S...

DIELECTRIC/METAL BARRIER INTEGRATION TO PREVENT COPPER DIFFUSION