Sreenivasan K Koduri

Person

Allen, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Printed package and method of making the same
- Patent number 12,230,594
- Issue date Feb 18, 2025
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Miniature sensor cavities
- Patent number 12,203,776
- Issue date Jan 21, 2025
- Texas Instruments Incorporated
- Sreenivasan Kalyani Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Covers for semiconductor package components
- Patent number 12,198,995
- Issue date Jan 14, 2025
- Texas Instruments Incorporated
- Sreenivasan Kalyani Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-molded leadframes in semiconductor devices
- Patent number 12,191,273
- Issue date Jan 7, 2025
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframes in semiconductor devices
- Patent number 12,183,703
- Issue date Dec 31, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level bump stack for chip scale package
- Patent number 12,177,988
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional functional integration
- Patent number 12,074,098
- Issue date Aug 27, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with current sense element
- Patent number 12,066,459
- Issue date Aug 20, 2024
- Texas Instruments Incorporated
- Robert Allan Neidorff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional package for semiconductor devices and external co...
- Patent number 12,062,597
- Issue date Aug 13, 2024
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with separate communication and heat dissipation paths
- Patent number 12,040,249
- Issue date Jul 16, 2024
- Texas Instruments Incorporated
- Sreenivasan Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device multilevel package substrate for improved electro...
- Patent number 11,978,699
- Issue date May 7, 2024
- Texas Instruments Incorporated
- Sylvester Ankamah-Kusi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film covers for sensor packages
- Patent number 11,972,994
- Issue date Apr 30, 2024
- Texas Instruments Incorporated
- Sreenivasan Kalyani Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with metal die attach to substrate with multi-...
- Patent number 11,908,776
- Issue date Feb 20, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Proximity sensor
- Patent number 11,894,339
- Issue date Feb 6, 2024
- Texas Instruments Incorporated
- Sreenivasan Kalyani Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged device with die wrapped by a substrate
- Patent number 11,887,906
- Issue date Jan 30, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Nanowires plated on nanoparticles
- Patent number 11,869,864
- Issue date Jan 9, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC having a metal ring thereon for stress reduction
- Patent number 11,869,820
- Issue date Jan 9, 2024
- Texas Instruments Incorporated
- Amit Sureshkumar Nangia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-lead adapter
- Patent number 11,830,793
- Issue date Nov 28, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated capacitor with extended head bump bond pillar
- Patent number 11,810,843
- Issue date Nov 7, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automated analog and mixed-signal circuit design and validation
- Patent number 11,797,732
- Issue date Oct 24, 2023
- Texas Instruments Incorporated
- Ashish Khandelwal
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Coated semiconductor devices
- Patent number 11,791,248
- Issue date Oct 17, 2023
- Texas Instruments Incorporated
- Sreenivasan Kalyani Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric and metallic nanowire bond layers
- Patent number 11,791,296
- Issue date Oct 17, 2023
- Texas Instruments Incorporated
- Scott Robert Summerfelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Covers for semiconductor package components
- Patent number 11,784,103
- Issue date Oct 10, 2023
- Texas Instruments Incorporated
- Sreenivasan Kalyani Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device with pillars having flared ends
- Patent number 11,756,914
- Issue date Sep 12, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmatic circuit partitioning and topology identification
- Patent number 11,748,533
- Issue date Sep 5, 2023
- Texas Instruments Incorporated
- Ashish Khandelwal
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Industrial chip scale package for microelectronic device
- Patent number 11,749,616
- Issue date Sep 5, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die orifices containing metallic nanowires
- Patent number 11,728,242
- Issue date Aug 15, 2023
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automated analog and mixed-signal circuit design and validation
- Patent number 11,727,175
- Issue date Aug 15, 2023
- Texas Instruments Incorporated
- Timothy W. Fischer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Nanomaterials for attaching mechanical force sensors
- Patent number 11,714,011
- Issue date Aug 1, 2023
- Texas Instruments Incorporated
- Ralf Jakobskrueger Muenster
- G01 - MEASURING TESTING
Information Patent Grant
Structure and method for semiconductor packaging
- Patent number 11,705,414
- Issue date Jul 18, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH CURRENT SENSE ELEMENT
- Publication number 20240369598
- Publication date Nov 7, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Robert Allan NEIDORFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE MULTILEVEL PACKAGE SUBSTRATE FOR IMPROVED ELECTRO...
- Publication number 20240297109
- Publication date Sep 5, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sylvester Ankamah-Kusi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH ISOLATION
- Publication number 20240258211
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM COVERS FOR SENSOR PACKAGES
- Publication number 20240243024
- Publication date Jul 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan Kalyani Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPEN CAVITY INTEGRATED CIRCUIT
- Publication number 20240178085
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- STEVEN ALFRED KUMMERL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROXIMITY SENSOR
- Publication number 20240178184
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan Kalyani KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE
- Publication number 20240162163
- Publication date May 16, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL HIGH CURRENT HALL SENSOR WITH INTEGRATED HEAT SLUG CURRENT...
- Publication number 20240096767
- Publication date Mar 21, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Hank Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BASED MOLDED FLIP CHIP ROUTABLE IC PACKAGE
- Publication number 20240096771
- Publication date Mar 21, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COVERS FOR SEMICONDUCTOR PACKAGE COMPONENTS
- Publication number 20240038609
- Publication date Feb 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan Kalyani KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL PACKAGE FOR SEMICONDUCTOR DEVICES AND EXTERNAL CO...
- Publication number 20230352373
- Publication date Nov 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR POWER SEMICONDUCTOR DEVICES
- Publication number 20230326913
- Publication date Oct 12, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING
- Publication number 20230299027
- Publication date Sep 21, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL FUNCTIONAL INTEGRATION
- Publication number 20230260879
- Publication date Aug 17, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR ON MICROELECTRONIC DIE
- Publication number 20230253443
- Publication date Aug 10, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM COVERS FOR SENSOR PACKAGES
- Publication number 20230253277
- Publication date Aug 10, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan Kalyani KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED SEMICONDUCTOR DEVICES
- Publication number 20230163050
- Publication date May 25, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan Kalyani Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE MULTILEVEL PACKAGE SUBSTRATE FOR IMPROVED ELECTRO...
- Publication number 20230055211
- Publication date Feb 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sylvester Ankamah-Kusi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE CAVITIES WITH POLYMER FILMS
- Publication number 20230030266
- Publication date Feb 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan Kalyani KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHAPED INTERCONNECT BUMPS IN SEMICONDUCTOR DEVICES
- Publication number 20230012200
- Publication date Jan 12, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF A PASSIVE COMPONENT IN A CAVITY OF AN INTEGRATED CIR...
- Publication number 20220415768
- Publication date Dec 29, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey MORRONI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST RELIABLE FAN-OUT FAN-IN CHIP SCALE PACKAGE
- Publication number 20220392817
- Publication date Dec 8, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC HAVING A METAL RING THEREON FOR STRESS REDUCTION
- Publication number 20220336304
- Publication date Oct 20, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Amit Sureshkumar Nangia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIROW GULL-WING PACKAGE FOR MICROELECRONIC DEVICES
- Publication number 20220277965
- Publication date Sep 1, 2022
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFIGURABLE LEADED PACKAGE
- Publication number 20220230944
- Publication date Jul 21, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan Kalyani Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR FORCE SENSORS
- Publication number 20220221353
- Publication date Jul 14, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Tobias Bernhard FRITZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED PACKAGE AND METHOD OF MAKING THE SAME
- Publication number 20220208701
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL PACKAGE FOR SEMICONDUCTOR DEVICES AND EXTERNAL CO...
- Publication number 20220208655
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR POWER SEMICONDUCTOR DEVICES
- Publication number 20220208745
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE CAVITIES WITH POLYMER FILMS
- Publication number 20220199479
- Publication date Jun 23, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan Kalyani KODURI
- H01 - BASIC ELECTRIC ELEMENTS

Sreenivasan K Koduri

Person

Patents Grantslast 30 patents

Printed package and method of making the same

Miniature sensor cavities

Covers for semiconductor package components

Pre-molded leadframes in semiconductor devices

Leadframes in semiconductor devices

Wafer level bump stack for chip scale package

Three-dimensional functional integration

Integrated circuit package with current sense element

Three dimensional package for semiconductor devices and external co...

Packages with separate communication and heat dissipation paths

Electronic device multilevel package substrate for improved electro...

Film covers for sensor packages

Semiconductor device with metal die attach to substrate with multi-...

Proximity sensor

Packaged device with die wrapped by a substrate

Nanowires plated on nanoparticles

IC having a metal ring thereon for stress reduction

Multi-lead adapter

Integrated capacitor with extended head bump bond pillar

Automated analog and mixed-signal circuit design and validation

Coated semiconductor devices

Dielectric and metallic nanowire bond layers

Covers for semiconductor package components

Microelectronic device with pillars having flared ends

Programmatic circuit partitioning and topology identification

Industrial chip scale package for microelectronic device

Semiconductor die orifices containing metallic nanowires

Automated analog and mixed-signal circuit design and validation

Nanomaterials for attaching mechanical force sensors

Structure and method for semiconductor packaging

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGE WITH CURRENT SENSE ELEMENT

ELECTRONIC DEVICE MULTILEVEL PACKAGE SUBSTRATE FOR IMPROVED ELECTRO...

SEMICONDUCTOR DEVICE PACKAGE WITH ISOLATION

FILM COVERS FOR SENSOR PACKAGES

OPEN CAVITY INTEGRATED CIRCUIT

PROXIMITY SENSOR

INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE

VERTICAL HIGH CURRENT HALL SENSOR WITH INTEGRATED HEAT SLUG CURRENT...

WAFER BASED MOLDED FLIP CHIP ROUTABLE IC PACKAGE

COVERS FOR SEMICONDUCTOR PACKAGE COMPONENTS

THREE DIMENSIONAL PACKAGE FOR SEMICONDUCTOR DEVICES AND EXTERNAL CO...

PACKAGE FOR POWER SEMICONDUCTOR DEVICES

STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING

THREE-DIMENSIONAL FUNCTIONAL INTEGRATION

INDUCTOR ON MICROELECTRONIC DIE

FILM COVERS FOR SENSOR PACKAGES

COATED SEMICONDUCTOR DEVICES

ELECTRONIC DEVICE MULTILEVEL PACKAGE SUBSTRATE FOR IMPROVED ELECTRO...

SENSOR PACKAGE CAVITIES WITH POLYMER FILMS

SHAPED INTERCONNECT BUMPS IN SEMICONDUCTOR DEVICES

INTEGRATION OF A PASSIVE COMPONENT IN A CAVITY OF AN INTEGRATED CIR...

LOW COST RELIABLE FAN-OUT FAN-IN CHIP SCALE PACKAGE

IC HAVING A METAL RING THEREON FOR STRESS REDUCTION

MULTIROW GULL-WING PACKAGE FOR MICROELECRONIC DEVICES

CONFIGURABLE LEADED PACKAGE

SEMICONDUCTOR FORCE SENSORS

PRINTED PACKAGE AND METHOD OF MAKING THE SAME

THREE DIMENSIONAL PACKAGE FOR SEMICONDUCTOR DEVICES AND EXTERNAL CO...

PACKAGE FOR POWER SEMICONDUCTOR DEVICES

SENSOR PACKAGE CAVITIES WITH POLYMER FILMS