Sridhar Idapalapati

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Enhancing metal/low-K interconnect reliability using a protection l...
- Patent number 8,486,824
- Issue date Jul 16, 2013
- STMicroelectronics Asia Pacific Pte., Ltd.
- Tong Yan Tee
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Enhancing metal/low-K interconnect reliability using a protection l...
- Patent number 8,217,518
- Issue date Jul 10, 2012
- STMicroelectronics Asia Pacific Pte., Ltd.
- Tong Yan Tee
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
ENHANCING METAL/LOW-K INTERCONNECT RELIABILITY USING A PROTECTION L...
- Publication number 20130012016
- Publication date Jan 10, 2013
- STMicroelectronics Asia Pacific Pte. Ltd.
- Tong Yan Tee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhancing metal/low-K interconnect reliability using a protection l...
- Publication number 20070216032
- Publication date Sep 20, 2007
- STMicroelectronics Asia Pacific Pte. Ltd.
- Tong Yan Tee
- H01 - BASIC ELECTRIC ELEMENTS