Sridhar Narasimhan

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Package for a microelectronic die, microelectronic assembly contain...
- Patent number 9,478,476
- Issue date Oct 25, 2016
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package and method for a compression-based mid-leve...
- Patent number 8,440,506
- Issue date May 14, 2013
- Intel Corporation
- Brent M. Roberts
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Patch on interposer through PGA interconnect structures
- Patent number 8,381,393
- Issue date Feb 26, 2013
- Intel Corporation
- Brent M. Roberts
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Microelectronic package and method for a compression-based mid-leve...
- Patent number 8,278,752
- Issue date Oct 2, 2012
- Intel Corporation
- Brent M. Roberts
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Soldering a die to a substrate
- Patent number 7,332,423
- Issue date Feb 19, 2008
- Intel Corporation
- Robert Starkston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE FOR A MICROELECTRONIC DIE, MICROELECTRONIC ASSEMBLY CONTAIN...
- Publication number 20130270691
- Publication date Oct 17, 2013
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE AND METHOD FOR A COMPRESSION-BASED MID-LEVE...
- Publication number 20120279059
- Publication date Nov 8, 2012
- Brent M. Roberts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Patch on interposer through PGA interconnect structures
- Publication number 20110157808
- Publication date Jun 30, 2011
- Intel Corporation
- Brent M. Roberts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE AND METHOD FOR A COMPRESSION-BASED MID-LEVE...
- Publication number 20110147913
- Publication date Jun 23, 2011
- Brent M. Roberts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Soldering a die to a substrate
- Publication number 20070001318
- Publication date Jan 4, 2007
- Robert Starkston
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...