Srikanth KULKARNI

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San Diego, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Selective mold placement on integrated circuit (IC) packages and me...
- Patent number 11,742,253
- Issue date Aug 29, 2023
- QUALCOMM Incorporated
- Sayok Chattopadhyay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for arrayed partial molding of packages
- Patent number 11,211,263
- Issue date Dec 28, 2021
- QUALCOMM Incorporated
- Srikanth Kulkarni
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE MOLD PLACEMENT ON INTEGRATED CIRCUIT (IC) PACKAGES AND ME...
- Publication number 20210351096
- Publication date Nov 11, 2021
- QUALCOMM Incorporated
- Sayok CHATTOPADHYAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING DUMMY INTERCONNECTS
- Publication number 20210280507
- Publication date Sep 9, 2021
- QUALCOMM Incorporated
- Manuel ALDRETE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR ARRAYED PARTIAL MOLDING OF PACKAGES
- Publication number 20210151330
- Publication date May 20, 2021
- QUALCOMM Incorporated
- Srikanth KULKARNI
- H01 - BASIC ELECTRIC ELEMENTS