Srikanth Narasimulau

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Mold for encapsulating a semiconductor chip
- Patent number 6,860,731
- Issue date Mar 1, 2005
- ASM Technology Singapore Pte. Ltd.
- Shu Chuen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold for a semiconductor chip
- Patent number 6,674,165
- Issue date Jan 6, 2004
- ASM Technology Singapore Pte. Ltd.
- Shu Chuen Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Mold
- Publication number 20030034555
- Publication date Feb 20, 2003
- ASM Technology Singapore Pte Ltd
- Shu Chuen Ho
- H01 - BASIC ELECTRIC ELEMENTS