Srinivas Gandikota

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Enhancing gapfill performance of dram word line
- Patent number 12,114,488
- Issue date Oct 8, 2024
- Applied Materials, Inc.
- Yong Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated dipole region for transistor
- Patent number 12,112,951
- Issue date Oct 8, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for processing a substrate
- Patent number 12,104,243
- Issue date Oct 1, 2024
- Applied Materials, Inc.
- Annamalai Lakshmanan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Amorphous silicon-based scavenging and sealing EOT
- Patent number 12,100,595
- Issue date Sep 24, 2024
- Applied Materials, Inc.
- Yong Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluorine-free tungsten ALD for dielectric selectivity improvement
- Patent number 12,062,545
- Issue date Aug 13, 2024
- Applied Materials, Inc.
- Ilanit Fisher
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
PMOS high-k metal gates
- Patent number 12,051,734
- Issue date Jul 30, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal based hydrogen barrier
- Patent number 12,020,982
- Issue date Jun 25, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistivity DRAM buried word line stack
- Patent number 12,022,650
- Issue date Jun 25, 2024
- Applied Materials, Inc.
- Yixiong Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
P-type dipole for P-FET
- Patent number 11,996,455
- Issue date May 28, 2024
- Applied Materials, Inc.
- Yongjing Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
V-NAND stacks with dipole regions
- Patent number 11,997,849
- Issue date May 28, 2024
- Applied Materials, Inc.
- Yong Yang
- G11 - INFORMATION STORAGE
Information Patent Grant
Treatments to enhance material structures
- Patent number 11,961,734
- Issue date Apr 16, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treatments to enhance material structures
- Patent number 11,955,332
- Issue date Apr 9, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lids and lid assembly kits for atomic layer deposition chambers
- Patent number 11,932,939
- Issue date Mar 19, 2024
- Applied Materials, Inc.
- Muhammad M. Rasheed
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of forming semiconductor structures
- Patent number 11,908,914
- Issue date Feb 20, 2024
- Applied Materials, Inc.
- Ria Someshwar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated dipole flow for transistor
- Patent number 11,888,045
- Issue date Jan 30, 2024
- Applied Materials, Inc.
- Yongjing Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced spatial ALD of metals through controlled precursor mixing
- Patent number 11,887,856
- Issue date Jan 30, 2024
- Applied Materials, Inc.
- Kelvin Chan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for depositing fluorine/carbon-free conformal tungsten
- Patent number 11,887,855
- Issue date Jan 30, 2024
- Applied Materials, Inc.
- Xinyu Fu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of forming molybdenum contacts
- Patent number 11,869,806
- Issue date Jan 9, 2024
- Applied Materials, Inc.
- Seshadri Ganguli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CVD based oxide-metal multi structure for 3D NAND memory devices
- Patent number 11,817,320
- Issue date Nov 14, 2023
- Applied Materials, Inc.
- Susmit Singha Roy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for reflector film growth
- Patent number 11,776,980
- Issue date Oct 3, 2023
- Applied Materials, Inc.
- Luping Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High temperature chemical vapor deposition lid
- Patent number 11,732,358
- Issue date Aug 22, 2023
- Applied Materials, Inc.
- Muhannad Mustafa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conformal high concentration boron doping of semiconductors
- Patent number 11,705,335
- Issue date Jul 18, 2023
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
P-type dipole for p-FET
- Patent number 11,658,218
- Issue date May 23, 2023
- Applied Materials, Inc.
- Yongjing Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of tuning film properties of metal nitride using plasma
- Patent number 11,646,226
- Issue date May 9, 2023
- Applied Materials, Inc.
- Wenyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doped and undoped vanadium oxides for low-k spacer applications
- Patent number 11,621,160
- Issue date Apr 4, 2023
- Applied Materials, Inc.
- Eswaranand Venkatasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene diffusion barrier
- Patent number 11,621,226
- Issue date Apr 4, 2023
- Applied Materials, Inc.
- Yong Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic housing systems
- Patent number 11,587,764
- Issue date Feb 21, 2023
- Applied Materials, Inc.
- Srinivas Gandikota
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low resistivity DRAM buried word line stack
- Patent number 11,587,936
- Issue date Feb 21, 2023
- Applied Materials, Inc.
- Yixiong Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
In-situ high power implant to relieve stress of a thin film
- Patent number 11,557,478
- Issue date Jan 17, 2023
- Applied Materials, Inc.
- Eswaranand Venkatasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PMOS high-K metal gates
- Patent number 11,552,177
- Issue date Jan 10, 2023
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH-THROUGHPUT PLASMA LID FOR SEMICONDUCTOR MANUFACTURING PROCESSI...
- Publication number 20240371613
- Publication date Nov 7, 2024
- Applied Materials, Inc.
- Muhannad Mustafa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HALIDE AND ORGANIC PRECURSORS FOR METAL DEPOSITION
- Publication number 20240360557
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTI-THRESHOLD VOLTAGE INTEGRATION SCHEME FOR SEMICONDUCTOR DEVICES
- Publication number 20240363723
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DIPOLE REGION FOR TRANSISTOR
- Publication number 20240332008
- Publication date Oct 3, 2024
- Applied Materials, Inc.
- Geetika Bajaj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING IMPURITY FREE METAL ALLOY FILMS
- Publication number 20240287678
- Publication date Aug 29, 2024
- Applied Materials, Inc.
- Geetika Bajaj
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
V-NAND STACKS WITH DIPOLE REGIONS
- Publication number 20240268108
- Publication date Aug 8, 2024
- Applied Materials, Inc.
- Yong Yang
- G11 - INFORMATION STORAGE
Information Patent Application
MULTI-VT INTEGRATION SCHEME FOR SEMICONDUCTOR DEVICES
- Publication number 20240266414
- Publication date Aug 8, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TREATMENTS TO ENHANCE MATERIAL STRUCTURES
- Publication number 20240266163
- Publication date Aug 8, 2024
- Applied Materials, Inc.
- Srinivas GANDIKOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA-ENHANCED MOLYBDENUM DEPOSITION
- Publication number 20240218502
- Publication date Jul 4, 2024
- Applied Materials, Inc.
- TUERXUN AILIHUMAER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DIPOLE FORMATION PROCESSES
- Publication number 20240222195
- Publication date Jul 4, 2024
- Applied Materials, Inc.
- Tianyi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REDUCING METAL GATE RESISTANCE FOR NEXT GENERATION NMOS D...
- Publication number 20240204061
- Publication date Jun 20, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BASED HYDROGEN BARRIER
- Publication number 20240194526
- Publication date Jun 13, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PULSE DEPOSITION PROCESSES
- Publication number 20240183033
- Publication date Jun 6, 2024
- Applied Materials, Inc.
- Tianyi Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BATCH PROCESSING CHAMBERS FOR PLASMA-ENHANCED DEPOSITION
- Publication number 20240170254
- Publication date May 23, 2024
- Applied Materials, Inc.
- Jianming Fu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR STRUCTURES
- Publication number 20240154018
- Publication date May 9, 2024
- Applied Materials, Inc.
- Ria Someshwar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA-ENHANCED MOLYBDENUM DEPOSITION
- Publication number 20240102157
- Publication date Mar 28, 2024
- Applied Materials, Inc.
- TUERXUN AILIHUMAER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RADICAL TREATMENT FOR METAL GATE STACK
- Publication number 20240087899
- Publication date Mar 14, 2024
- Applied Materials, Inc.
- Zhihui Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL MOLYBDENUM DEPOSITION
- Publication number 20240060175
- Publication date Feb 22, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATED DIPOLE REGION FOR TRANSISTOR
- Publication number 20240063064
- Publication date Feb 22, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL MOLYBDENUM DEPOSITION
- Publication number 20240026529
- Publication date Jan 25, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FORMATION OF CONFORMAL ALD SIO2 FILMS
- Publication number 20230416909
- Publication date Dec 28, 2023
- Applied Materials, Inc.
- Geetika BAJAJ
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATOMIC LAYER DEPOSITION OF HIGH DIELECTRIC CONSTANT MATERIALS
- Publication number 20230420486
- Publication date Dec 28, 2023
- Applied Materials, Inc.
- Geetika Bajaj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER DEPOSITION USING NOVEL OXYGEN-CONTAINING PRECURSORS
- Publication number 20230416915
- Publication date Dec 28, 2023
- Applied Materials, Inc.
- Geetika Bajaj
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR PATTERNING SUBSTRATES TO ADJUST VOLTAGE PROPERTIES
- Publication number 20230402291
- Publication date Dec 14, 2023
- Applied Materials, Inc.
- Steven C. H. HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYER FOR PREVENTING ALUMINUM DIFFUSION
- Publication number 20230377879
- Publication date Nov 23, 2023
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PATTERNING SUBSTRATES TO ADJUST VOLTAGE PROPERTIES
- Publication number 20230377901
- Publication date Nov 23, 2023
- Applied Materials, Inc.
- Steven C. H. HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CLEANING AND SELECTIVE MOLYBDENUM DEPOSITION PROCESSES
- Publication number 20230323543
- Publication date Oct 12, 2023
- Applied Materials, Inc.
- Tuerxun Ailihumaer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FIELD SUPPRESSED METAL GAPFILL
- Publication number 20230326744
- Publication date Oct 12, 2023
- Applied Materials, Inc.
- Annamalai Lakshmanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING INTERCONNECT STRUCTURE
- Publication number 20230295804
- Publication date Sep 21, 2023
- Applied Materials, Inc.
- Srinivas Gandikota
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATED DIPOLE REGION FOR TRANSISTOR
- Publication number 20230260791
- Publication date Aug 17, 2023
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS

Srinivas Gandikota

Person

Patents Grantslast 30 patents

Enhancing gapfill performance of dram word line

Integrated dipole region for transistor

Methods and apparatus for processing a substrate

Amorphous silicon-based scavenging and sealing EOT

Fluorine-free tungsten ALD for dielectric selectivity improvement

PMOS high-k metal gates

Metal based hydrogen barrier

Low resistivity DRAM buried word line stack

P-type dipole for P-FET

V-NAND stacks with dipole regions

Treatments to enhance material structures

Treatments to enhance material structures

Lids and lid assembly kits for atomic layer deposition chambers

Methods of forming semiconductor structures

Integrated dipole flow for transistor

Enhanced spatial ALD of metals through controlled precursor mixing

Methods for depositing fluorine/carbon-free conformal tungsten

Methods of forming molybdenum contacts

CVD based oxide-metal multi structure for 3D NAND memory devices

Methods for reflector film growth

High temperature chemical vapor deposition lid

Conformal high concentration boron doping of semiconductors

P-type dipole for p-FET

Method of tuning film properties of metal nitride using plasma

Doped and undoped vanadium oxides for low-k spacer applications

Graphene diffusion barrier

Magnetic housing systems

Low resistivity DRAM buried word line stack

In-situ high power implant to relieve stress of a thin film

PMOS high-K metal gates

Patents Applicationslast 30 patents

HIGH-THROUGHPUT PLASMA LID FOR SEMICONDUCTOR MANUFACTURING PROCESSI...

HALIDE AND ORGANIC PRECURSORS FOR METAL DEPOSITION

MULTI-THRESHOLD VOLTAGE INTEGRATION SCHEME FOR SEMICONDUCTOR DEVICES

INTEGRATED DIPOLE REGION FOR TRANSISTOR

METHODS FOR FORMING IMPURITY FREE METAL ALLOY FILMS

V-NAND STACKS WITH DIPOLE REGIONS

MULTI-VT INTEGRATION SCHEME FOR SEMICONDUCTOR DEVICES

TREATMENTS TO ENHANCE MATERIAL STRUCTURES

PLASMA-ENHANCED MOLYBDENUM DEPOSITION

DIPOLE FORMATION PROCESSES

METHOD OF REDUCING METAL GATE RESISTANCE FOR NEXT GENERATION NMOS D...

METAL BASED HYDROGEN BARRIER

MULTI-PULSE DEPOSITION PROCESSES

BATCH PROCESSING CHAMBERS FOR PLASMA-ENHANCED DEPOSITION

METHODS OF FORMING SEMICONDUCTOR STRUCTURES

PLASMA-ENHANCED MOLYBDENUM DEPOSITION

RADICAL TREATMENT FOR METAL GATE STACK

CONFORMAL MOLYBDENUM DEPOSITION

INTEGRATED DIPOLE REGION FOR TRANSISTOR

CONFORMAL MOLYBDENUM DEPOSITION

METHOD FOR FORMATION OF CONFORMAL ALD SIO2 FILMS

ATOMIC LAYER DEPOSITION OF HIGH DIELECTRIC CONSTANT MATERIALS

ATOMIC LAYER DEPOSITION USING NOVEL OXYGEN-CONTAINING PRECURSORS

METHODS FOR PATTERNING SUBSTRATES TO ADJUST VOLTAGE PROPERTIES

BARRIER LAYER FOR PREVENTING ALUMINUM DIFFUSION

METHODS FOR PATTERNING SUBSTRATES TO ADJUST VOLTAGE PROPERTIES

INTEGRATED CLEANING AND SELECTIVE MOLYBDENUM DEPOSITION PROCESSES

FIELD SUPPRESSED METAL GAPFILL

METHOD OF FORMING INTERCONNECT STRUCTURE

INTEGRATED DIPOLE REGION FOR TRANSISTOR