Srinivas GUGGILLA

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-layer stacks for 3D NAND extendability
- Patent number 11,569,257
- Issue date Jan 31, 2023
- Applied Materials, Inc.
- Xinhai Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple spacer patterning schemes
- Patent number 11,527,408
- Issue date Dec 13, 2022
- Applied Materials, Inc.
- Tzu-shun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for modifying photoresist profiles and tuning critical dime...
- Patent number 11,456,173
- Issue date Sep 27, 2022
- Applied Materials, Inc.
- Meenakshi Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple spacer patterning schemes
- Patent number 11,315,787
- Issue date Apr 26, 2022
- Applied Materials, Inc.
- Tzu-shun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for co-sputtering multiple targets
- Patent number 11,101,117
- Issue date Aug 24, 2021
- Applied Materials, Inc.
- Anantha K. Subramani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for depositing dielectric barrier layers and aluminum conta...
- Patent number 10,707,122
- Issue date Jul 7, 2020
- Applied Materials, Inc.
- Sree Rangasai V. Kesapragada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer stacks for 3D NAND extendibility
- Patent number 10,700,087
- Issue date Jun 30, 2020
- Applied Materials, Inc.
- Xinhai Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for co-sputtering multiple targets
- Patent number 10,468,238
- Issue date Nov 5, 2019
- Applied Materials, Inc.
- Anantha K. Subramani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for depositing dielectric barrier layers and aluminum conta...
- Patent number 10,109,520
- Issue date Oct 23, 2018
- Applied Materials, Inc.
- Sree Rangasai V. Kesapragada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for protecting metal interconnect from halogen...
- Patent number 10,002,834
- Issue date Jun 19, 2018
- Applied Materials, Inc.
- Mehul B. Naik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of formation
- Patent number 9,984,976
- Issue date May 29, 2018
- Applied Materials, Inc.
- Yana Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum nitride barrier layer
- Patent number 9,646,876
- Issue date May 9, 2017
- Applied Materials, Inc.
- Deenesh Padhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for depositing dielectric films via physical vapor depositi...
- Patent number 9,633,839
- Issue date Apr 25, 2017
- Applied Materials, Inc.
- Weimin Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for cleaning substrates
- Patent number 6,908,865
- Issue date Jun 21, 2005
- Applied Materials, Inc.
- Martin Kranz
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE ETCHING OF SILICON-CONTAINING MATERIAL RELATIVE TO METAL-...
- Publication number 20240266185
- Publication date Aug 8, 2024
- Applied Materials, Inc.
- Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY ETCH OF BORON-CONTAINING MATERIAL
- Publication number 20240249953
- Publication date Jul 25, 2024
- Applied Materials, Inc.
- Yeonju Kwak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SACRIFICIAL LAYER FOR FORMING MERGED HIGH ASPECT RATIO CONTACTS IN...
- Publication number 20240090213
- Publication date Mar 14, 2024
- Applied Materials, Inc.
- Jialiang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON MOLD FOR DRAM CAPACITOR
- Publication number 20240038833
- Publication date Feb 1, 2024
- Applied Materials, Inc.
- Fredrick Fishburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE SPACER PATTERNING SCHEMES
- Publication number 20230093450
- Publication date Mar 23, 2023
- Applied Materials, Inc.
- Tzu-shun YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE SPACER PATTERNING SCHEMES
- Publication number 20200335338
- Publication date Oct 22, 2020
- Applied Materials, Inc.
- Tzu-Shun YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE SPACER PATTERNING SCHEMES
- Publication number 20200335339
- Publication date Oct 22, 2020
- Applied Materials, Inc.
- Tzu-shun YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MODIFYING PHOTORESIST PROFILES AND TUNING CRITICAL DIIM...
- Publication number 20200321210
- Publication date Oct 8, 2020
- Applied Materials, Inc.
- Meenakshi GUPTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER STACKS FOR 3D NAND EXTENDABILITY
- Publication number 20200295041
- Publication date Sep 17, 2020
- Applied Materials, Inc.
- Xinhai HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR CO-SPUTTERING MULTIPLE TARGETS
- Publication number 20200013597
- Publication date Jan 9, 2020
- Applied Materials, Inc.
- Anantha K. SUBRAMANI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND APPARATUS FOR PROTECTING METAL INTERCONNECT FROM HALOGEN...
- Publication number 20190348369
- Publication date Nov 14, 2019
- Mehul B. NAIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER STACKS FOR 3D NAND EXTENDABILITY
- Publication number 20190115365
- Publication date Apr 18, 2019
- Applied Materials, Inc.
- Xinhai HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR DEPOSITING DIELECTRIC BARRIER LAYERS AND ALUMINUM CONTA...
- Publication number 20190027403
- Publication date Jan 24, 2019
- Applied Materials, Inc.
- Sree Rangasai V. KESAPRAGADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR DEPOSITING DIELECTRIC BARRIER LAYERS AND ALUMINUM CONTA...
- Publication number 20170098575
- Publication date Apr 6, 2017
- Applied Materials, Inc.
- Sree Rangasai V. KESAPRAGADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR CO-SPUTTERING MULTIPLE TARGETS
- Publication number 20170053784
- Publication date Feb 23, 2017
- Applied Materials, Inc.
- Anantha K. SUBRAMANI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR DEPOSITING DIELECTRIC FILMS VIA PHYSICAL VAPOR DEPOSITI...
- Publication number 20160372319
- Publication date Dec 22, 2016
- Applied Materials, Inc.
- Weimin ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR PROTECTING METAL INTERCONNECT FROM HALOGEN...
- Publication number 20160268207
- Publication date Sep 15, 2016
- Applied Materials, Inc.
- Mehul B. NAIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM NITRIDE BARRIER LAYER
- Publication number 20160254181
- Publication date Sep 1, 2016
- Applied Materials, Inc.
- Deenesh Padhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES AND METHODS OF FORMATION
- Publication number 20160240483
- Publication date Aug 18, 2016
- Applied Materials, Inc.
- YANA CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING SYSTEM AND METHODS THEREOF
- Publication number 20100304027
- Publication date Dec 2, 2010
- Applied Materials, Inc.
- Wei Ti Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and apparatus for cleaning substrates
- Publication number 20030062333
- Publication date Apr 3, 2003
- APPLIED MATERIALS, INC.
- Martin Kranz
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Srinivas GUGGILLA

Person

Patents Grantslast 30 patents

Multi-layer stacks for 3D NAND extendability

Multiple spacer patterning schemes

Methods for modifying photoresist profiles and tuning critical dime...

Multiple spacer patterning schemes

Methods and apparatus for co-sputtering multiple targets

Methods for depositing dielectric barrier layers and aluminum conta...

Multi-layer stacks for 3D NAND extendibility

Methods and apparatus for co-sputtering multiple targets

Methods for depositing dielectric barrier layers and aluminum conta...

Method and apparatus for protecting metal interconnect from halogen...

Interconnect structures and methods of formation

Aluminum nitride barrier layer

Methods for depositing dielectric films via physical vapor depositi...

Method and apparatus for cleaning substrates

Patents Applicationslast 30 patents

SELECTIVE ETCHING OF SILICON-CONTAINING MATERIAL RELATIVE TO METAL-...

DRY ETCH OF BORON-CONTAINING MATERIAL

SACRIFICIAL LAYER FOR FORMING MERGED HIGH ASPECT RATIO CONTACTS IN...

CARBON MOLD FOR DRAM CAPACITOR

MULTIPLE SPACER PATTERNING SCHEMES

MULTIPLE SPACER PATTERNING SCHEMES

MULTIPLE SPACER PATTERNING SCHEMES

METHODS FOR MODIFYING PHOTORESIST PROFILES AND TUNING CRITICAL DIIM...

MULTI-LAYER STACKS FOR 3D NAND EXTENDABILITY

METHODS AND APPARATUS FOR CO-SPUTTERING MULTIPLE TARGETS

METHOD AND APPARATUS FOR PROTECTING METAL INTERCONNECT FROM HALOGEN...

MULTI-LAYER STACKS FOR 3D NAND EXTENDABILITY

METHODS FOR DEPOSITING DIELECTRIC BARRIER LAYERS AND ALUMINUM CONTA...

METHODS FOR DEPOSITING DIELECTRIC BARRIER LAYERS AND ALUMINUM CONTA...

METHODS AND APPARATUS FOR CO-SPUTTERING MULTIPLE TARGETS

METHODS FOR DEPOSITING DIELECTRIC FILMS VIA PHYSICAL VAPOR DEPOSITI...

METHOD AND APPARATUS FOR PROTECTING METAL INTERCONNECT FROM HALOGEN...

ALUMINUM NITRIDE BARRIER LAYER

INTERCONNECT STRUCTURES AND METHODS OF FORMATION

SUBSTRATE PROCESSING SYSTEM AND METHODS THEREOF

Method and apparatus for cleaning substrates