Srinivasa N. Reddy

Person

LeGrangeville, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electromigration-resistant lead-free solder interconnect structures
- Patent number 9,379,007
- Issue date Jun 28, 2016
- Globalfoundries Inc.
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additives for grain fragmentation in Pb-free Sn-based solder
- Patent number 8,493,746
- Issue date Jul 23, 2013
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Creation of lead-free solder joint with intermetallics
- Patent number 8,268,716
- Issue date Sep 18, 2012
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intermetallic diffusion block device and method of manufacture
- Patent number 7,683,493
- Issue date Mar 23, 2010
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment verification for C4NP solder transfer
- Patent number 7,666,780
- Issue date Feb 23, 2010
- International Business Machines Corporation
- Jerry A. Gorrell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for point of care osmolarity testing
- Patent number 7,344,679
- Issue date Mar 18, 2008
- International Business Machines Corporation
- Govindarajan Natarajan
- G01 - MEASURING TESTING
Information Patent Grant
Multilayer ceramic substrate with single via anchored pad and metho...
- Patent number 6,987,316
- Issue date Jan 17, 2006
- International Business Machines Corporation
- Srinivasa N. Reddy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Discrete magnets in dielectric forming metal/ceramic laminate and p...
- Patent number 6,974,358
- Issue date Dec 13, 2005
- International Business Machines Corporation
- Govindarajan Natarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer capacitor built on silicon wafer and joined to a ceramic...
- Patent number 6,943,108
- Issue date Sep 13, 2005
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced high-frequency via interconnection for improved reliability
- Patent number 6,900,395
- Issue date May 31, 2005
- International Business Machines Corporation
- Janet L. Jozwiak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer capacitor built on silicon wafer and joined to a ceramic...
- Patent number 6,791,133
- Issue date Sep 14, 2004
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete magnets in dielectric forming metal/ceramic laminate and p...
- Patent number 6,653,776
- Issue date Nov 25, 2003
- International Business Machines Corporation
- Govindarajan Natarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CVD of metals capable of receiving nickel or alloys thereof using i...
- Patent number 6,569,496
- Issue date May 27, 2003
- International Business Machines Corporation
- Donald Rene Wall
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming features on a ceramic substrate using platible pa...
- Patent number 6,565,917
- Issue date May 20, 2003
- International Business Machines Corporation
- Srinivasa S. N. Reddy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process of forming metal/ferrite laminated magnet
- Patent number 6,494,758
- Issue date Dec 17, 2002
- International Business Machines Corporation
- Govindarajan Natarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-cavity substrate structure for discrete devices
- Patent number 6,489,686
- Issue date Dec 3, 2002
- International Business Machines Corporation
- Mukta S. Farooq
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Decoupling capacitor method and structure using metal based carrier
- Patent number 6,461,493
- Issue date Oct 8, 2002
- International Business Machines Corporation
- Mukta S. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature sintering of ferrite materials
- Patent number 6,413,339
- Issue date Jul 2, 2002
- International Business Machines Corporation
- Govindarajan Natarajan
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Surface metallization structure for multiple chip test and burn-in
- Patent number 6,376,054
- Issue date Apr 23, 2002
- International Business Machines Corporation
- Scott I. Langenthal
- G01 - MEASURING TESTING
Information Patent Grant
Copper-based paste containing copper aluminate for microstructural...
- Patent number 6,358,439
- Issue date Mar 19, 2002
- International Business Machines Corporation
- Farid Youssif Aoude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor on ceramic
- Patent number 6,339,527
- Issue date Jan 15, 2002
- International Business Machines Corporation
- Mukta S. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced interconnection to ceramic substrates
- Patent number 6,319,829
- Issue date Nov 20, 2001
- International Business Machines Corporation
- Robert W. Pasco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic substrate with anchored pad
- Patent number 6,312,791
- Issue date Nov 6, 2001
- International Business Machines Corporation
- Benjamin V. Fasano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and materials for increasing the strength of crystalline cer...
- Patent number 6,258,191
- Issue date Jul 10, 2001
- International Business Machines Corporation
- Benjamin V. Fasano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-cavity substrate structure for discrete devices
- Patent number 6,228,682
- Issue date May 8, 2001
- International Business Machines Corporation
- Mukta S. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for pre-cleaning and post-cleaning deposited metal
- Patent number 6,227,943
- Issue date May 8, 2001
- International Business Machines Corporation
- John J. Garant
- B24 - GRINDING POLISHING
Information Patent Grant
CVD of metals capable of receiving nickel or alloys thereof using i...
- Patent number 6,224,682
- Issue date May 1, 2001
- International Business Machines Corporation
- Donald Rene Wall
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multilayer ceramic substrate with anchored pad
- Patent number 6,187,418
- Issue date Feb 13, 2001
- International Business Machines Corporation
- Benjamin V. Fasano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing ceramic surfaces with easily removable contact...
- Patent number 6,139,666
- Issue date Oct 31, 2000
- International Business Machines Corporation
- Benjamin V. Fasano
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Ceramic substrate having a sealed layer
- Patent number 6,136,419
- Issue date Oct 24, 2000
- International Business Machines Corporation
- Benjamin V. Fasano
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
ELECTROMIGRATION-RESISTANT LEAD-FREE SOLDER INTERCONNECT STRUCTURES
- Publication number 20130249066
- Publication date Sep 26, 2013
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION-RESISTANT LEAD-FREE SOLDER INTERCONNECT STRUCTURES
- Publication number 20130252418
- Publication date Sep 26, 2013
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING UNDERBUMP METALLURGY STRUCTURE EMPLOYING SPUTTER-...
- Publication number 20120202343
- Publication date Aug 9, 2012
- International Business Machines Corporation
- Luc Belanger
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CREATION OF LEAD-FREE SOLDER JOINT WITH INTERMETALLICS
- Publication number 20120083113
- Publication date Apr 5, 2012
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER
- Publication number 20100200271
- Publication date Aug 12, 2010
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERMETALLIC DIFFUSION BLOCK DEVICE AND METHOD OF MANUFACTURE
- Publication number 20090267228
- Publication date Oct 29, 2009
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT VERIFICATION FOR C4NP SOLDER TRANSFER
- Publication number 20090181533
- Publication date Jul 16, 2009
- International Business Machines Corporation
- Jerry A. Gorrell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
UNDERBUMP METALLURGY EMPLOYING SPUTTER-DEPOSITED NICKEL TITANIUM ALLOY
- Publication number 20090140423
- Publication date Jun 4, 2009
- International Business Machines Corporation
- Luc Belanger
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
UNDERBUMP METALLURGY EMPLOYING SPUTTER-DEPOSITED NICKEL TITANIUM CO...
- Publication number 20090134016
- Publication date May 28, 2009
- International Business Machines Corporation
- Luc Belanger
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD AND APPARATUS FOR POINT OF CARE OSMOLARITY TESTING
- Publication number 20080053206
- Publication date Mar 6, 2008
- Govindarajan Natarajan
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND APPARATUS FOR POINT OF CARE OSMOLARITY TESTING
- Publication number 20080050282
- Publication date Feb 28, 2008
- Govindarajan Natarajan
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND APPARATUS FOR POINT OF CARE OSMOLARITY TESTING
- Publication number 20070086927
- Publication date Apr 19, 2007
- International Business Machines Corporation
- Govindarajan Natarajan
- G01 - MEASURING TESTING
Information Patent Application
MULTILAYER CERAMIC SUBSTRATE WITH SINGLE VIA ANCHORED PAD AND METHO...
- Publication number 20050151241
- Publication date Jul 14, 2005
- International Business Machines Corporation
- Srinivasa N. Reddy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interposer capacitor built on silicon wafer and joined to a ceramic...
- Publication number 20040245556
- Publication date Dec 9, 2004
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced high-frequency via interconnection for improved reliability
- Publication number 20040100754
- Publication date May 27, 2004
- International Business Machines Corporation
- Janet J. Jozwiak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interposer capacitor built on silicon wafer and joined to a ceramic...
- Publication number 20040014313
- Publication date Jan 22, 2004
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Discrete magnets in dielectric forming metal/ceramic laminate and p...
- Publication number 20030205967
- Publication date Nov 6, 2003
- Govindarajan Natarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-cavity substrate structure for discrete devices
- Publication number 20010010398
- Publication date Aug 2, 2001
- International Business Machines Corporation
- Mutka S. Farooq
- H01 - BASIC ELECTRIC ELEMENTS

Srinivasa N. Reddy

Person

Patents Grantslast 30 patents

Electromigration-resistant lead-free solder interconnect structures

Additives for grain fragmentation in Pb-free Sn-based solder

Creation of lead-free solder joint with intermetallics

Intermetallic diffusion block device and method of manufacture

Alignment verification for C4NP solder transfer

Method and apparatus for point of care osmolarity testing

Multilayer ceramic substrate with single via anchored pad and metho...

Discrete magnets in dielectric forming metal/ceramic laminate and p...

Interposer capacitor built on silicon wafer and joined to a ceramic...

Enhanced high-frequency via interconnection for improved reliability

Interposer capacitor built on silicon wafer and joined to a ceramic...

Discrete magnets in dielectric forming metal/ceramic laminate and p...

CVD of metals capable of receiving nickel or alloys thereof using i...

Method of forming features on a ceramic substrate using platible pa...

Process of forming metal/ferrite laminated magnet

Multi-cavity substrate structure for discrete devices

Decoupling capacitor method and structure using metal based carrier

Low temperature sintering of ferrite materials

Surface metallization structure for multiple chip test and burn-in

Copper-based paste containing copper aluminate for microstructural...

Thin film capacitor on ceramic

Enhanced interconnection to ceramic substrates

Multilayer ceramic substrate with anchored pad

Method and materials for increasing the strength of crystalline cer...

Multi-cavity substrate structure for discrete devices

Method and system for pre-cleaning and post-cleaning deposited metal

CVD of metals capable of receiving nickel or alloys thereof using i...

Multilayer ceramic substrate with anchored pad

Method for producing ceramic surfaces with easily removable contact...

Ceramic substrate having a sealed layer

Patents Applicationslast 30 patents

ELECTROMIGRATION-RESISTANT LEAD-FREE SOLDER INTERCONNECT STRUCTURES

ELECTROMIGRATION-RESISTANT LEAD-FREE SOLDER INTERCONNECT STRUCTURES

METHOD OF FORMING UNDERBUMP METALLURGY STRUCTURE EMPLOYING SPUTTER-...

CREATION OF LEAD-FREE SOLDER JOINT WITH INTERMETALLICS

ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER

INTERMETALLIC DIFFUSION BLOCK DEVICE AND METHOD OF MANUFACTURE

ALIGNMENT VERIFICATION FOR C4NP SOLDER TRANSFER

UNDERBUMP METALLURGY EMPLOYING SPUTTER-DEPOSITED NICKEL TITANIUM ALLOY

UNDERBUMP METALLURGY EMPLOYING SPUTTER-DEPOSITED NICKEL TITANIUM CO...

METHOD AND APPARATUS FOR POINT OF CARE OSMOLARITY TESTING

METHOD AND APPARATUS FOR POINT OF CARE OSMOLARITY TESTING

METHOD AND APPARATUS FOR POINT OF CARE OSMOLARITY TESTING

MULTILAYER CERAMIC SUBSTRATE WITH SINGLE VIA ANCHORED PAD AND METHO...

Interposer capacitor built on silicon wafer and joined to a ceramic...

Enhanced high-frequency via interconnection for improved reliability

Interposer capacitor built on silicon wafer and joined to a ceramic...

Discrete magnets in dielectric forming metal/ceramic laminate and p...

Multi-cavity substrate structure for discrete devices