Srinivasa R. Aravamudhan

Person

Beaverton, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Heated pins to couple with solder elements
- Patent number 11,830,846
- Issue date Nov 28, 2023
- Intel Corporation
- Feroz Mohammad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure features to alter the shape of a socket
- Patent number 11,569,596
- Issue date Jan 31, 2023
- Intel Corporation
- Steven A. Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface structure method and apparatus associated with compute or e...
- Patent number 10,573,580
- Issue date Feb 25, 2020
- Intel Corporation
- Srinivasa R. Aravamudhan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pin through solder interconnect and methods
- Patent number 10,505,297
- Issue date Dec 10, 2019
- Intel Corporation
- Feroz Mohammad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pin through solder interconnect and methods
- Patent number 10,355,380
- Issue date Jul 16, 2019
- Intel Corporation
- Feroz Mohammad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure to enhance yield of TMI interconnections
- Patent number 10,049,971
- Issue date Aug 14, 2018
- Intel Corporation
- Thomas J. De Bonis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure to enhance yield of TMI interconnections
- Patent number 9,613,933
- Issue date Apr 4, 2017
- Intel Corporation
- Thomas J. De Bonis
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METAL ORGANIC FRAMEWORKS (MOFS) FILLER FOR ENABLING LOW CTE AND LOW...
- Publication number 20230309220
- Publication date Sep 28, 2023
- Intel Corporation
- Yang JIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRESSURE FEATURES TO ALTER THE SHAPE OF A SOCKET
- Publication number 20210305731
- Publication date Sep 30, 2021
- Intel Corporation
- Steven A. KLEIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATED PINS TO COUPLE WITH SOLDER ELEMENTS
- Publication number 20200381388
- Publication date Dec 3, 2020
- Intel Corporation
- Feroz MOHAMMAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIN THROUGH SOLDER INTERCONNECT AND METHODS
- Publication number 20190305451
- Publication date Oct 3, 2019
- Intel Corporation
- Feroz Mohammad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE STRUCTURE METHOD AND APPARATUS ASSOCIATED WITH COMPUTE OR E...
- Publication number 20180288877
- Publication date Oct 4, 2018
- Intel Corporation
- Srinivasa R. Aravamudhan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package Structure To Enhance Yield of TMI Interconnections
- Publication number 20170207152
- Publication date Jul 20, 2017
- Intel Corporation
- Thomas J. De Bonis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure To Enhance Yield of TMI Interconnections
- Publication number 20150255415
- Publication date Sep 10, 2015
- Thomas J. De Bonis
- H01 - BASIC ELECTRIC ELEMENTS

Srinivasa R. Aravamudhan

Person

Patents Grantslast 30 patents

Heated pins to couple with solder elements

Pressure features to alter the shape of a socket

Surface structure method and apparatus associated with compute or e...

Pin through solder interconnect and methods

Pin through solder interconnect and methods

Package structure to enhance yield of TMI interconnections

Package structure to enhance yield of TMI interconnections

Patents Applicationslast 30 patents

METAL ORGANIC FRAMEWORKS (MOFS) FILLER FOR ENABLING LOW CTE AND LOW...

PRESSURE FEATURES TO ALTER THE SHAPE OF A SOCKET

HEATED PINS TO COUPLE WITH SOLDER ELEMENTS

PIN THROUGH SOLDER INTERCONNECT AND METHODS

SURFACE STRUCTURE METHOD AND APPARATUS ASSOCIATED WITH COMPUTE OR E...

Package Structure To Enhance Yield of TMI Interconnections

Package Structure To Enhance Yield of TMI Interconnections