Srinivasan Kannan

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Maplewood, MN, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of controlling wafer bow in a type III-V semiconductor device
- Patent number 12,080,785
- Issue date Sep 3, 2024
- Infineon Technologies Austria AG
- Seong-Eun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of controlling wafer bow in a type III-V semiconductor device
- Patent number 11,387,355
- Issue date Jul 12, 2022
- Infineon Technologies Austria AG
- Seong-Eun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of controlling wafer bow in a type III-V semiconductor device
- Patent number 10,720,520
- Issue date Jul 21, 2020
- Infineon Technologies Austria AG
- Seong-Eun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component with a multi-layered nucleation body
- Patent number 9,728,610
- Issue date Aug 8, 2017
- Infineon Technologies Americas Corp.
- Jianwei Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
III-nitride semiconductor device with doped epi structures
- Patent number 9,608,075
- Issue date Mar 28, 2017
- Infineon Technologies Americas Corp.
- Jianwei Wan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of Controlling Wafer Bow in a Type III-V Semiconductor Device
- Publication number 20220344499
- Publication date Oct 27, 2022
- Seong-Eun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Controlling Wafer Bow in a Type III-V Semiconductor Device
- Publication number 20200303531
- Publication date Sep 24, 2020
- Seong-Eun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Controlling Wafer Bow in a Type III-V Semiconductor Device
- Publication number 20180374941
- Publication date Dec 27, 2018
- Infineon Technologies Austria AG
- Seong-Eun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Component with a Multi-Layered Nucleation Body
- Publication number 20170229548
- Publication date Aug 10, 2017
- Infineon Technologies Americas Corp.
- Jianwei Wan
- H01 - BASIC ELECTRIC ELEMENTS