Srinivasan Parthasarathy

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Santa Clara, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip with stratified underfill
- Patent number 7,745,264
- Issue date Jun 29, 2010
- Advanced Micro Devices, Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming solder joints for a flip chip assembly
- Patent number 7,601,612
- Issue date Oct 13, 2009
- GLOBALFOUNDRIES Inc.
- Raj N. Master
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free semiconductor package
- Patent number 7,215,030
- Issue date May 8, 2007
- Advanced Micro Devices, Inc.
- Raj N. Master
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Chip with Stratified Underfill
- Publication number 20090057928
- Publication date Mar 5, 2009
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead-free semiconductor package
- Publication number 20060289977
- Publication date Dec 28, 2006
- Advanced Micro Devices, Inc.
- Raj N. Master
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR