Ssu-Chiang WENG

Person

New Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Protection structures for bonded wafers
- Patent number 11,791,205
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ssu-Chiang Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection structures for bonded wafers
- Patent number 11,004,733
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ssu-Chiang Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with reduced leakage current and fabricating m...
- Patent number 9,893,107
- Issue date Feb 13, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of dielectric grid with a metal pillar for semiconductor...
- Patent number 9,130,077
- Issue date Sep 8, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ssu-Chiang Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diode mounted on intersected and discontinuous trans...
- Patent number 8,604,510
- Issue date Dec 10, 2013
- Everlight Electronics Co., Ltd.
- Ssu-Yuan Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED package structure with a fuse for protection from high current
- Patent number 8,552,450
- Issue date Oct 8, 2013
- Everlight Electronics Co., Ltd.
- Ssu-Yuan Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED package structure with fuse
- Patent number 8,222,665
- Issue date Jul 17, 2012
- Everlight Electronics Co., Ltd.
- Ssu-Yuan Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED packaging structure and fabricating method thereof
- Patent number 8,193,551
- Issue date Jun 5, 2012
- Everlight Electronics Co., Ltd.
- Ssu Yuan Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diode module and manufacturing method thereof
- Patent number 8,110,842
- Issue date Feb 7, 2012
- Everlight Electronics Co., Ltd.
- Ssu-Yuan Weng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Protection Structures for Bonded Wafers
- Publication number 20200006128
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ssu-Chiang Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDUCED LEAKAGE CURRENT AND FABRI...
- Publication number 20170084657
- Publication date Mar 23, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Yu WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure of Dielectric Grid with a Metal Pillar for Semiconductor...
- Publication number 20150048467
- Publication date Feb 19, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ssu-Chiang Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light-Emitting Diode Mounted On Transparent Conductive Layers And M...
- Publication number 20130032850
- Publication date Feb 7, 2013
- EVERLIGHT ELECTRONICS CO., LTD
- Ssu-Yuan Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED Packaging Structure and Fabricating Method Thereof
- Publication number 20120211791
- Publication date Aug 23, 2012
- EVERLIGHT ELECTRONICS CO., LTD
- Ssu Yuan Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED Package Structure
- Publication number 20110278639
- Publication date Nov 17, 2011
- EVERLIGHT ELECTRONICS CO., LTD
- Ssu-Yuan Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20100193802
- Publication date Aug 5, 2010
- EVERLIGHT ELECTRONICS CO., LTD.
- Ssu-Yuan WENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED packaging structure and fabricating method thereof
- Publication number 20100181587
- Publication date Jul 22, 2010
- EVERLIGHT ELECTRONICS CO., LTD.
- SSU YUAN WENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light-emitting diode module and the manufacturing thereof
- Publication number 20080283856
- Publication date Nov 20, 2008
- Everlight Electronics Co., Ltd.
- Ssu-Yuan Weng
- H01 - BASIC ELECTRIC ELEMENTS

Ssu-Chiang WENG

Person

Patents Grantslast 30 patents

Protection structures for bonded wafers

Protection structures for bonded wafers

Semiconductor device with reduced leakage current and fabricating m...

Structure of dielectric grid with a metal pillar for semiconductor...

Light-emitting diode mounted on intersected and discontinuous trans...

LED package structure with a fuse for protection from high current

LED package structure with fuse

LED packaging structure and fabricating method thereof

Light-emitting diode module and manufacturing method thereof

Patents Applicationslast 30 patents

Protection Structures for Bonded Wafers

SEMICONDUCTOR DEVICE WITH REDUCED LEAKAGE CURRENT AND FABRI...

Structure of Dielectric Grid with a Metal Pillar for Semiconductor...

Light-Emitting Diode Mounted On Transparent Conductive Layers And M...

LED Packaging Structure and Fabricating Method Thereof

LED Package Structure

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

LED packaging structure and fabricating method thereof

Light-emitting diode module and the manufacturing thereof