Stanley A. Cejka

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Cedar Park, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Substrate dielectric crack prevention using interleaved metal plane
- Patent number 10,537,019
- Issue date Jan 14, 2020
- NXP USA, INC.
- Tingdong Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and devices with enhanced grounding and shielding for wire...
- Patent number 10,256,193
- Issue date Apr 9, 2019
- NXP USA, INC.
- James S. Golab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package materials monitor and method therefor
- Patent number 10,147,654
- Issue date Dec 4, 2018
- NXP USA, INC.
- Stanley Andrew Cejka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit interconnect crack monitor circuit
- Patent number 9,377,504
- Issue date Jun 28, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Stanley A. Cejka
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE MATERIALS MONITOR AND METHOD THEREFOR
- Publication number 20180112972
- Publication date Apr 26, 2018
- FREESCALE SEMICONDUCTOR, INC.
- STANLEY ANDREW CEJKA
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT INTERCONNECT CRACK MONITOR CIRCUIT
- Publication number 20150276854
- Publication date Oct 1, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Stanley A. Cejka
- G01 - MEASURING TESTING