Stanley Craig Beddingfield

Person

McKinney, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Millimeter wave integrated circuit with ball grid array package inc...
- Patent number 10,262,957
- Issue date Apr 16, 2019
- Texas Instruments Incorporated
- Rajen Manicon Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter wave integrated circuit with ball grid array package inc...
- Patent number 9,941,228
- Issue date Apr 10, 2018
- Texas Instruments Incorporated
- Rajen Manicon Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter wave integrated circuit with ball grid array package inc...
- Patent number 9,666,553
- Issue date May 30, 2017
- Texas Instruments Incorporated
- Rajen Manicon Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crack arrest vias for IC devices
- Patent number 8,304,867
- Issue date Nov 6, 2012
- Texas Instruments Incorporated
- Robert Fabian McCarthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having integrated faraday shield
- Patent number 8,049,119
- Issue date Nov 1, 2011
- Texas Instruments Incorporated
- Stanley C Beddingfield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having integrated faraday shield
- Patent number 7,741,567
- Issue date Jun 22, 2010
- Texas Instruments Incorporated
- Stanley Craig Beddingfield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch bumping with improved device standoff and bump volume
- Patent number 6,372,622
- Issue date Apr 16, 2002
- Motorola, Inc.
- Qing Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip bump structure and method of making
- Patent number 5,977,632
- Issue date Nov 2, 1999
- Motorola, Inc.
- Stanley Craig Beddingfield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumped semiconductor device with alignment features and method for...
- Patent number 5,726,502
- Issue date Mar 10, 1998
- Motorola, Inc.
- Stanley C. Beddingfield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for underfilling a flip-chip semiconductor device
- Patent number 5,710,071
- Issue date Jan 20, 1998
- Motorola, Inc.
- Stanley C. Beddingfield
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INC...
- Publication number 20180301428
- Publication date Oct 18, 2018
- Rajen Manicon Murugan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INC...
- Publication number 20170229408
- Publication date Aug 10, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Rajen Manicon MURUGAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INC...
- Publication number 20150364816
- Publication date Dec 17, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Rajen Manicon MURUGAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRACK ARREST VIAS FOR IC DEVICES
- Publication number 20120104604
- Publication date May 3, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Robert Fabian McCarthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Improving Reliability of Integrated Circuit P...
- Publication number 20110204511
- Publication date Aug 25, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Stanley Craig BEDDINGFIELD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER CHIP SCALE PACKAGE TEST FLOW AND DICING PROCESS
- Publication number 20110193200
- Publication date Aug 11, 2011
- Kevin P. Lyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package Having Integrated Faraday Shield
- Publication number 20100214759
- Publication date Aug 26, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Stanley Craig BEDDINGFIELD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENVIRONMENTAL DIE SEAL ENHANCEMENT FOR WAFER LEVEL CHIP SCALE PACKAGES
- Publication number 20100078769
- Publication date Apr 1, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey A. WEST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING INTEGRATED FARADAY SHIELD
- Publication number 20090284947
- Publication date Nov 19, 2009
- Stanley Craig Beddingfield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABILITY WCSP LAYOUTS
- Publication number 20090278263
- Publication date Nov 12, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Robert Fabian McCarthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Improving Reliability of Integrated Circuit P...
- Publication number 20090140401
- Publication date Jun 4, 2009
- Stanley Craig Beddingfield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power plane design and jumper wire bond for voltage drop minimization
- Publication number 20070029661
- Publication date Feb 8, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Stanley Craig Beddingfield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual BGA alloy structure for improved board-level reliability perfo...
- Publication number 20070023910
- Publication date Feb 1, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Stanley Craig Beddingfield
- H01 - BASIC ELECTRIC ELEMENTS

Stanley Craig Beddingfield

Person

Patents Grantslast 30 patents

Millimeter wave integrated circuit with ball grid array package inc...

Millimeter wave integrated circuit with ball grid array package inc...

Millimeter wave integrated circuit with ball grid array package inc...

Crack arrest vias for IC devices

Integrated circuit package having integrated faraday shield

Integrated circuit package having integrated faraday shield

Fine pitch bumping with improved device standoff and bump volume

Flip chip bump structure and method of making

Bumped semiconductor device with alignment features and method for...

Process for underfilling a flip-chip semiconductor device

Patents Applicationslast 30 patents

MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INC...

MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INC...

MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INC...

CRACK ARREST VIAS FOR IC DEVICES

System and Method for Improving Reliability of Integrated Circuit P...

SEMICONDUCTOR WAFER CHIP SCALE PACKAGE TEST FLOW AND DICING PROCESS

Integrated Circuit Package Having Integrated Faraday Shield

ENVIRONMENTAL DIE SEAL ENHANCEMENT FOR WAFER LEVEL CHIP SCALE PACKAGES

INTEGRATED CIRCUIT PACKAGE HAVING INTEGRATED FARADAY SHIELD

RELIABILITY WCSP LAYOUTS

System and Method for Improving Reliability of Integrated Circuit P...

Power plane design and jumper wire bond for voltage drop minimization

Dual BGA alloy structure for improved board-level reliability perfo...