Stanley Gaicki

Follow

Person

Tempe, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Lower cost semiconductor package with good thermal properties
- Patent number 4,285,003
- Issue date Aug 18, 1981
- Motorola, Inc.
- Stanley Gaicki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic bonding head
- Patent number 4,067,039
- Issue date Jan 3, 1978
- Motorola, Inc.
- Stanley Gaicki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic bonding head
- Patent number 4,063,673
- Issue date Dec 20, 1977
- Motorola, Inc.
- Stanley Gaicki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method for semiconductor device manufacture
- Patent number 3,996,659
- Issue date Dec 14, 1976
- Motorola, Inc.
- Stanley Gaicki
- H01 - BASIC ELECTRIC ELEMENTS