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Stanley J. Klepeis
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Poughkeepsie, NY, US
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last 30 patents
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Patent Grant
IC chip uniform delayering methods
Patent number
7,504,337
Issue date
Mar 17, 2009
International Business Machines Corporation
Keith E. Barton
G01 - MEASURING TESTING
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Patent Grant
Ti liner for copper interconnect with low-k dielectric
Patent number
6,661,097
Issue date
Dec 9, 2003
International Business Machines Corporation
Larry Clevenger
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
IC CHIP UNIFORM DELAYERING METHODS
Publication number
20080233751
Publication date
Sep 25, 2008
Keith E. Barton
G01 - MEASURING TESTING