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Stanley J. Wang
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Albany, OR, US
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Patents Grants
last 30 patents
Information
Patent Grant
Corrosion tolerant micro-electromechanical fluid ejection device
Patent number
11,787,180
Issue date
Oct 17, 2023
Hewlett-Packard Development Company, L.P.
Stanley J. Wang
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Thermal fluid ejection heating element
Patent number
11,155,085
Issue date
Oct 26, 2021
Hewlett-Packard Development Company, L.P.
Stanley J Wang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Thermal inkjet resistor circuit
Patent number
10,675,867
Issue date
Jun 9, 2020
Hewlett-Packard Development Company, L.P.
Stanley J. Wang
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Grant
Isolating failed resistors
Patent number
10,272,671
Issue date
Apr 30, 2019
Hewlett-Packard Development Company, L.P.
Stanley J. Wang
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Grant
Power switching transistor and method of manufacture for a fluid ej...
Patent number
6,800,497
Issue date
Oct 5, 2004
Hewlett-Packard Development Company, L.P.
Stanley J. Wang
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Patents Applications
last 30 patents
Information
Patent Application
CORROSION TOLERANT MICRO-ELECTROMECHANICAL FLUID EJECTION DEVICE
Publication number
20230415482
Publication date
Dec 28, 2023
Hewlett-Packard Development Company, L.P.
Stanley J. Wang
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
EPITAXIAL-SILICON WAFER WITH A BURIED OXIDE LAYER
Publication number
20220177296
Publication date
Jun 9, 2022
Hewlett-Packard Development Company, L.P.
Stanley J. Wang
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
FLUID FEED HOLE
Publication number
20220118763
Publication date
Apr 21, 2022
Hewlett-Packard Development Company, L.P.
Vincent C. Korthuis
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Application
MANUFACTURING A CORROSION TOLERANT MICRO-ELECTROMECHANICAL FLUID EJ...
Publication number
20220048763
Publication date
Feb 17, 2022
Hewlett-Packard Development Company, L.P.
Stanley J. Wang
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
A CORROSION TOLERANT MICRO-ELECTROMECHANICAL FLUID EJECTION DEVICE
Publication number
20220040977
Publication date
Feb 10, 2022
Hewlett-Packard Development Company, L.P.
Stanley J. Wang
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
THERMAL FLUID EJECTION HEATING ELEMENT
Publication number
20200139707
Publication date
May 7, 2020
Hewlett-Packard Development Company, L.P.
Stanley J Wang
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Application
THERMAL INKJET RESISTOR CIRCUIT
Publication number
20190210362
Publication date
Jul 11, 2019
Hewlett-Packard Development Company, L.P.
Stanley J. Wang
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Application
ISOLATING FAILED RESISTORS
Publication number
20180222181
Publication date
Aug 9, 2018
Hewlett-Packard Development Company, L.P.
Stanley J. Wang
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Application
Power switching transistor and method of manufacture for a fluid ej...
Publication number
20030202023
Publication date
Oct 30, 2003
Stanley J. Wang
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS