Stanley Job Doraisamy

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Kuala Lumpur, MY

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Patents Grantslast 30 patents

Information Patent Grant
Integrated semiconductor outline package
- Patent number 8,169,069
- Issue date May 1, 2012
- Infineon Technologies AG
- Stanley Job Doraisamy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Integrated Semiconductor Outline Package
- Publication number 20120162924
- Publication date Jun 28, 2012
- Infineon Technologies AG
- Stanley Job Doraisamy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device
- Publication number 20090230519
- Publication date Sep 17, 2009
- INFINEON TECHNOLOGIES AG
- Ralf OTREMBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Component Package
- Publication number 20080160677
- Publication date Jul 3, 2008
- Soon Hock TONG
- H01 - BASIC ELECTRIC ELEMENTS