Stanley Job Doraisamy

Person

Kuala Lumpur, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Lead frame with mold lock structure
- Patent number 9,293,395
- Issue date Mar 22, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Wai Keong Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with recess for die attachment
- Patent number 9,171,786
- Issue date Oct 27, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Soon Kang Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with gel filled cavity
- Patent number 9,136,399
- Issue date Sep 15, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Stanley Job Doraisamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic device on leadframe
- Patent number 8,642,394
- Issue date Feb 4, 2014
- Infineon Technologies AG
- Abdul Rahman Mohamed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device having a resin with wa...
- Patent number 8,377,753
- Issue date Feb 19, 2013
- Infineon Technologies AG
- Chai Wei Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including isolation layer
- Patent number 8,110,906
- Issue date Feb 7, 2012
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having a resin with warpage compensated surfaces
- Patent number 8,067,841
- Issue date Nov 29, 2011
- Infineon Technologies AG
- Chai Wei Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having maximized bonding areas of electrica...
- Patent number 7,791,182
- Issue date Sep 7, 2010
- Infineon Technologies AG
- Wae Chet Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming component package
- Patent number 7,723,165
- Issue date May 25, 2010
- Infineon Technologies AG
- Soon Hock Tong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEAD FRAME WITH MOLD LOCK STRUCTURE
- Publication number 20150270195
- Publication date Sep 24, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Wai Keong Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH GEL FILLED CAVITY
- Publication number 20150137278
- Publication date May 21, 2015
- Stanley Job Doraisamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Fabricating A Semiconductor Device Having A Resin With Wa...
- Publication number 20120058606
- Publication date Mar 8, 2012
- INFINEON TECHNOLOGIES AG
- Chai Wei Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20090212446
- Publication date Aug 27, 2009
- Chai Wei Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING
- Publication number 20090189259
- Publication date Jul 30, 2009
- INFINEON TECHNOLOGIES AG
- Abdul Rahman Mohamed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT AND METHOD OF PRODUCING
- Publication number 20090045493
- Publication date Feb 19, 2009
- INFINEON TECHNOLOGIES AG
- Wae Chet Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING ISOLATION LAYER
- Publication number 20080173992
- Publication date Jul 24, 2008
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS

Stanley Job Doraisamy

Person

Patents Grantslast 30 patents

Lead frame with mold lock structure

Integrated circuit with recess for die attachment

Semiconductor package with gel filled cavity

Method of manufacturing electronic device on leadframe

Method of fabricating a semiconductor device having a resin with wa...

Semiconductor device including isolation layer

Semiconductor devices having a resin with warpage compensated surfaces

Semiconductor component having maximized bonding areas of electrica...

Method of forming component package

Patents Applicationslast 30 patents

LEAD FRAME WITH MOLD LOCK STRUCTURE

SEMICONDUCTOR PACKAGE WITH GEL FILLED CAVITY

Method of Fabricating A Semiconductor Device Having A Resin With Wa...

Semiconductor Device

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING

SEMICONDUCTOR COMPONENT AND METHOD OF PRODUCING

SEMICONDUCTOR DEVICE INCLUDING ISOLATION LAYER