Stanley Seungchul Song

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Deep trench capacitors in an inter-layer medium on an interconnect...
- Patent number 11,973,019
- Issue date Apr 30, 2024
- QUALCOMM Incorporated
- Jihong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising integrated devices and bridge coupling top sides...
- Patent number 11,830,819
- Issue date Nov 28, 2023
- QUALCOMM Incorporated
- Bharani Chava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated circuit (3D IC) power distribution net...
- Patent number 11,626,359
- Issue date Apr 11, 2023
- QUALCOMM Incorporated
- Biancun Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) packages employing front side back-end-of-l...
- Patent number 11,552,055
- Issue date Jan 10, 2023
- QUALCOMM Incorporated
- Stanley Seungchul Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around (GAA) transistors with shallow source/drain regions...
- Patent number 11,545,555
- Issue date Jan 3, 2023
- QUALCOMM Incorporated
- Peijie Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die integrated with package voltage regulators
- Patent number 11,515,289
- Issue date Nov 29, 2022
- QUALCOMM Incorporated
- Bharani Chava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device comprising a CMOS structure comprising well-less...
- Patent number 11,502,079
- Issue date Nov 15, 2022
- QUALCOMM Incorporated
- Stanley Seungchul Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional (3D) integrated circuit device having a backside...
- Patent number 11,444,068
- Issue date Sep 13, 2022
- QUALCOMM Incorporated
- Stanley Seungchul Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field-effect transistors (FET) circuits employing topside and backs...
- Patent number 11,437,379
- Issue date Sep 6, 2022
- QUALCOMM Incorporated
- Stanley Seungchul Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuits employing a back side-front side connection structure for...
- Patent number 11,404,374
- Issue date Aug 2, 2022
- QUALCOMM Incorporated
- Hyeokjin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional (3D) integrated circuit (IC) integration of an em...
- Patent number 11,310,911
- Issue date Apr 19, 2022
- QUALCOMM Incorporated
- Stanley Seungchul Song
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hybrid conductor integration in power rail
- Patent number 11,302,638
- Issue date Apr 12, 2022
- QUALCOMM Incorporated
- John Jianhong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits (ICs) employing front side (FS) back end-of-lin...
- Patent number 11,270,991
- Issue date Mar 8, 2022
- QUALCOMM Incorporated
- Bharani Chava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around (GAA) transistors with additional bottom channel fo...
- Patent number 11,257,917
- Issue date Feb 22, 2022
- QUALCOMM Incorporated
- Jun Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intertwined well connection and decoupling capacitor layout structu...
- Patent number 11,244,895
- Issue date Feb 8, 2022
- QUALCOMM Incorporated
- Ramesh Manchana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal filling in a dielectric layer under metal layer one (M1)and a...
- Patent number 11,195,793
- Issue date Dec 7, 2021
- QUALCOMM Incorporated
- Bharani Chava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cell circuits formed in circuit cells employing offset gate cut are...
- Patent number 11,152,347
- Issue date Oct 19, 2021
- QUALCOMM Incorporated
- Stanley Seungchul Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor (FET) comprising channels with silicon germ...
- Patent number 11,145,654
- Issue date Oct 12, 2021
- QUALCOMM Incorporated
- Kwanyong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor for gate leakage detection
- Patent number 10,996,261
- Issue date May 4, 2021
- QUALCOMM Incorporated
- Hyunwoo Park
- G01 - MEASURING TESTING
Information Patent Grant
Contact liner to enable different CPP devices
- Patent number 10,847,507
- Issue date Nov 24, 2020
- QUALCOMM Incorporated
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bulk acoustic wave (BAW) and passive-on-glass (POG) filter co-integ...
- Patent number 10,840,884
- Issue date Nov 17, 2020
- QUALCOMM Incorporated
- Stanley Seungchul Song
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Circuits having a diffusion break with avoided or reduced adjacent...
- Patent number 10,763,364
- Issue date Sep 1, 2020
- QUALCOMM Incorporated
- Stanley Seungchul Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuits having a diffusion break with avoided or reduced adjacent...
- Patent number 10,700,204
- Issue date Jun 30, 2020
- QUALCOMM Incorporated
- Stanley Seungchul Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standard cell architecture with M1 layer unidirectional routing
- Patent number 10,593,700
- Issue date Mar 17, 2020
- QUALCOMM Incorporated
- Mukul Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned quadruple patterning process for Fin pitch below 20nm
- Patent number 10,559,501
- Issue date Feb 11, 2020
- QUALCOMM Incorporated
- Stanley Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits including a FinFET and a nanostructure FET
- Patent number 10,439,039
- Issue date Oct 8, 2019
- QUALCOMM Incorporated
- Stanley Seungchul Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modified self-aligned quadruple patterning (SAQP) processes using c...
- Patent number 10,418,244
- Issue date Sep 17, 2019
- QUALCOMM Incorporated
- Stanley Seungchul Song
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
High density and reliable vertical natural capacitors
- Patent number 10,325,979
- Issue date Jun 18, 2019
- QUALCOMM Incorporated
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adaptive pulse generation circuits for clocking pulse latches with...
- Patent number 10,291,211
- Issue date May 14, 2019
- QUALCOMM Incorporated
- Stanley Seungchul Song
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Middle-of-line (MOL) metal resistor temperature sensors for localiz...
- Patent number 10,247,617
- Issue date Apr 2, 2019
- QUALCOMM Incorporated
- Lixin Ge
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SELF-ALIGNED BACKSIDE CONTACT MODULE FOR 3DIC APPLICATION
- Publication number 20240096750
- Publication date Mar 21, 2024
- QUALCOMM Incorporated
- Qingqing LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING INTEGRATED DEVICES AND BRIDGE COUPLING TOP SIDES...
- Publication number 20240055356
- Publication date Feb 15, 2024
- QUALCOMM Incorporated
- Bharani CHAVA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE FOR MICRO-BUMPED WAFER PROBE
- Publication number 20230384367
- Publication date Nov 30, 2023
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE EMPLO...
- Publication number 20230317677
- Publication date Oct 5, 2023
- QUALCOMM Incorporated
- Stanley Seungchul Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH...
- Publication number 20230299048
- Publication date Sep 21, 2023
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING INTEGRATED DEVICES AND BRIDGE COUPLING TOP SIDES...
- Publication number 20220415808
- Publication date Dec 29, 2022
- QUALCOMM Incorporated
- Bharani CHAVA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITORS IN AN INTER-LAYER MEDIUM ON AN INTERCONNECT...
- Publication number 20220375851
- Publication date Nov 24, 2022
- QUALCOMM Incorporated
- Jihong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT (3D IC) POWER DISTRIBUTION NET...
- Publication number 20220344249
- Publication date Oct 27, 2022
- QUALCOMM Incorporated
- Biancun XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING FRONT SIDE BACK-END-OF-L...
- Publication number 20220165707
- Publication date May 26, 2022
- QUALCOMM Incorporated
- Stanley Seungchul SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUITS EMPLOYING A BACK SIDE-FRONT SIDE CONNECTION STRUCTURE FOR...
- Publication number 20220102266
- Publication date Mar 31, 2022
- QUALCOMM Incorporated
- Hyeokjin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD-EFFECT TRANSISTORS (FET) CIRCUITS EMPLOYING TOPSIDE AND BACKS...
- Publication number 20220093594
- Publication date Mar 24, 2022
- QUALCOMM Incorporated
- Stanley Seungchul SONG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
STACKED DIE INTEGRATED WITH PACKAGE VOLTAGE REGULATORS
- Publication number 20220077109
- Publication date Mar 10, 2022
- QUALCOMM Incorporated
- Bharani CHAVA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS (ICs) EMPLOYING FRONT SIDE (FS) BACK END-OF-LIN...
- Publication number 20220068906
- Publication date Mar 3, 2022
- QUALCOMM Incorporated
- Bharani Chava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE-ALL-AROUND (GAA) TRANSISTORS WITH SHALLOW SOURCE/DRAIN REGIONS...
- Publication number 20220037493
- Publication date Feb 3, 2022
- QUALCOMM Incorporated
- Peijie Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER DISTRIBUTION NETWORK (PDN) PROCESSING
- Publication number 20220028758
- Publication date Jan 27, 2022
- QUALCOMM Incorporated
- Stanley Seungchul SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT DEVICE HAVING A BACKSIDE...
- Publication number 20220020735
- Publication date Jan 20, 2022
- QUALCOMM Incorporated
- Stanley Seungchul SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) INTEGRATION OF AN EM...
- Publication number 20220022315
- Publication date Jan 20, 2022
- QUALCOMM Incorporated
- Stanley Seungchul SONG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
GATE-ALL-AROUND (GAA) TRANSISTORS WITH ADDITIONAL BOTTOM CHANNEL FO...
- Publication number 20210384310
- Publication date Dec 9, 2021
- QUALCOMM Incorporated
- Jun Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERTWINED WELL CONNECTION AND DECOUPLING CAPACITOR LAYOUT STRUCTU...
- Publication number 20210375747
- Publication date Dec 2, 2021
- QUALCOMM Incorporated
- Ramesh MANCHANA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FILLING UNDER M1 LAYER OF SEMICONDUCTOR DEVICES
- Publication number 20210217697
- Publication date Jul 15, 2021
- QUALCOMM Incorporated
- Bharani CHAVA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID CONDUCTOR INTEGRATION IN POWER RAIL
- Publication number 20210217699
- Publication date Jul 15, 2021
- QUALCOMM Incorporated
- John Jianhong ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD EFFECT TRANSISTOR (FET) COMPRISING CHANNELS WITH SILICON GERM...
- Publication number 20210118883
- Publication date Apr 22, 2021
- QUALCOMM Incorporated
- Kwanyong LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING A CMOS STRUCTURE COMPRISING WELL-LESS...
- Publication number 20210057410
- Publication date Feb 25, 2021
- QUALCOMM Incorporated
- Stanley Seungchul SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUITS HAVING A DIFFUSION BREAK WITH AVOIDED OR REDUCED ADJACENT...
- Publication number 20200303550
- Publication date Sep 24, 2020
- QUALCOMM Incorporated
- Stanley Seungchul Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED QUADRUPLE PATTERNING PROCESS FOR FIN PITCH BELOW 20nm
- Publication number 20200161189
- Publication date May 21, 2020
- QUALCOMM Incorporated
- Stanley SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUITS HAVING A DIFFUSION BREAK WITH AVOIDED OR REDUCED ADJACENT...
- Publication number 20200058792
- Publication date Feb 20, 2020
- QUALCOMM Incorporated
- Stanley Seungchul Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR FOR GATE LEAKAGE DETECTION
- Publication number 20200049757
- Publication date Feb 13, 2020
- QUALCOMM Incorporated
- Hyunwoo PARK
- G01 - MEASURING TESTING
Information Patent Application
CONTACT LINER TO ENABLE DIFFERENT CPP DEVICES
- Publication number 20190378830
- Publication date Dec 12, 2019
- QUALCOMM Incorporated
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BULK ACOUSTIC WAVE (BAW) AND PASSIVE-ON-GLASS (POG) FILTER CO-INTEG...
- Publication number 20190363694
- Publication date Nov 28, 2019
- QUALCOMM Incorporated
- Stanley Seungchul SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CELL CIRCUITS FORMED IN CIRCUIT CELLS EMPLOYING OFFSET GATE CUT ARE...
- Publication number 20190319022
- Publication date Oct 17, 2019
- QUALCOMM Incorporated
- Stanley Seungchul Song
- H01 - BASIC ELECTRIC ELEMENTS

Stanley Seungchul Song

Person

Patents Grantslast 30 patents

Deep trench capacitors in an inter-layer medium on an interconnect...

Package comprising integrated devices and bridge coupling top sides...

Three-dimensional integrated circuit (3D IC) power distribution net...

Integrated circuit (IC) packages employing front side back-end-of-l...

Gate-all-around (GAA) transistors with shallow source/drain regions...

Stacked die integrated with package voltage regulators

Integrated device comprising a CMOS structure comprising well-less...

Three-dimensional (3D) integrated circuit device having a backside...

Field-effect transistors (FET) circuits employing topside and backs...

Circuits employing a back side-front side connection structure for...

Three-dimensional (3D) integrated circuit (IC) integration of an em...

Hybrid conductor integration in power rail

Integrated circuits (ICs) employing front side (FS) back end-of-lin...

Gate-all-around (GAA) transistors with additional bottom channel fo...

Intertwined well connection and decoupling capacitor layout structu...

Metal filling in a dielectric layer under metal layer one (M1)and a...

Cell circuits formed in circuit cells employing offset gate cut are...

Field effect transistor (FET) comprising channels with silicon germ...

Sensor for gate leakage detection

Contact liner to enable different CPP devices

Bulk acoustic wave (BAW) and passive-on-glass (POG) filter co-integ...

Circuits having a diffusion break with avoided or reduced adjacent...

Circuits having a diffusion break with avoided or reduced adjacent...

Standard cell architecture with M1 layer unidirectional routing

Self-aligned quadruple patterning process for Fin pitch below 20nm

Integrated circuits including a FinFET and a nanostructure FET

Modified self-aligned quadruple patterning (SAQP) processes using c...

High density and reliable vertical natural capacitors

Adaptive pulse generation circuits for clocking pulse latches with...

Middle-of-line (MOL) metal resistor temperature sensors for localiz...

Patents Applicationslast 30 patents

SELF-ALIGNED BACKSIDE CONTACT MODULE FOR 3DIC APPLICATION

PACKAGE COMPRISING INTEGRATED DEVICES AND BRIDGE COUPLING TOP SIDES...

BUMP STRUCTURE FOR MICRO-BUMPED WAFER PROBE

THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE EMPLO...

THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH...

PACKAGE COMPRISING INTEGRATED DEVICES AND BRIDGE COUPLING TOP SIDES...

DEEP TRENCH CAPACITORS IN AN INTER-LAYER MEDIUM ON AN INTERCONNECT...

THREE-DIMENSIONAL INTEGRATED CIRCUIT (3D IC) POWER DISTRIBUTION NET...

INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING FRONT SIDE BACK-END-OF-L...

CIRCUITS EMPLOYING A BACK SIDE-FRONT SIDE CONNECTION STRUCTURE FOR...

FIELD-EFFECT TRANSISTORS (FET) CIRCUITS EMPLOYING TOPSIDE AND BACKS...

STACKED DIE INTEGRATED WITH PACKAGE VOLTAGE REGULATORS

INTEGRATED CIRCUITS (ICs) EMPLOYING FRONT SIDE (FS) BACK END-OF-LIN...

GATE-ALL-AROUND (GAA) TRANSISTORS WITH SHALLOW SOURCE/DRAIN REGIONS...

BACKSIDE POWER DISTRIBUTION NETWORK (PDN) PROCESSING

THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT DEVICE HAVING A BACKSIDE...

THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) INTEGRATION OF AN EM...

GATE-ALL-AROUND (GAA) TRANSISTORS WITH ADDITIONAL BOTTOM CHANNEL FO...

INTERTWINED WELL CONNECTION AND DECOUPLING CAPACITOR LAYOUT STRUCTU...

METAL FILLING UNDER M1 LAYER OF SEMICONDUCTOR DEVICES

HYBRID CONDUCTOR INTEGRATION IN POWER RAIL

FIELD EFFECT TRANSISTOR (FET) COMPRISING CHANNELS WITH SILICON GERM...

INTEGRATED DEVICE COMPRISING A CMOS STRUCTURE COMPRISING WELL-LESS...

CIRCUITS HAVING A DIFFUSION BREAK WITH AVOIDED OR REDUCED ADJACENT...

SELF-ALIGNED QUADRUPLE PATTERNING PROCESS FOR FIN PITCH BELOW 20nm

CIRCUITS HAVING A DIFFUSION BREAK WITH AVOIDED OR REDUCED ADJACENT...

SENSOR FOR GATE LEAKAGE DETECTION

CONTACT LINER TO ENABLE DIFFERENT CPP DEVICES

BULK ACOUSTIC WAVE (BAW) AND PASSIVE-ON-GLASS (POG) FILTER CO-INTEG...

CELL CIRCUITS FORMED IN CIRCUIT CELLS EMPLOYING OFFSET GATE CUT ARE...