Stefan Behler

Follow

Person

Steinhausen, CH

People

Patents Grantslast 30 patents

Information Patent Grant
Method for detaching and removing a semiconductor chip from a foil
- Patent number 8,715,457
- Issue date May 6, 2014
- Esec AG
- Stefan Behler
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for picking up semiconductor chips from a wafer table and me...
- Patent number 8,133,823
- Issue date Mar 13, 2012
- Oerlikon Assembly Equipment AG, Steinhausen
- Stefan Behler
- G05 - CONTROLLING REGULATING
Information Patent Grant
Method for aligning the bondhead of a Die Bonder
- Patent number 7,066,373
- Issue date Jun 27, 2006
- Unaxis International Trading Ltd
- Stefan Behler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die bonder and/or wire bonder with a device for holding down a subs...
- Patent number 6,585,145
- Issue date Jul 1, 2003
- ESEC Trading SA
- Stefan Behler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die bonder and/or wire bonder with a suction device for pulling fla...
- Patent number 6,435,492
- Issue date Aug 20, 2002
- ESEC Trading SA
- Stefan Behler
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS

Patents Applicationslast 30 patents

Information Patent Application
Method For Detaching And Removing A Semiconductor Chip From A Foil
- Publication number 20110214819
- Publication date Sep 8, 2011
- ESEC AG
- Stefan Behler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method And Device For Measuring A Height Difference
- Publication number 20100315655
- Publication date Dec 16, 2010
- ESEC AG
- Stefan Behler
- G01 - MEASURING TESTING
Information Patent Application
Method For Picking Up Semiconductor Chips From A Wafer Table And Me...
- Publication number 20090098667
- Publication date Apr 16, 2009
- OERLIKON ASSEMBLY EQUIPMENT AG, STEINHAUSEN
- Stefan Behler
- G05 - CONTROLLING REGULATING
Information Patent Application
Method for aligning the bondhead of a die bonder
- Publication number 20050061852
- Publication date Mar 24, 2005
- Stefan Behler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Die bonder and/or wire bonder with a device for holding down a subs...
- Publication number 20020066765
- Publication date Jun 6, 2002
- Stefan Behler
- H01 - BASIC ELECTRIC ELEMENTS