Stefan C. Lauxtermann

Person

Camarillo, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for backside illuminated image sensors using c...
- Patent number 8,097,904
- Issue date Jan 17, 2012
- Teledyne Scientific & Imaging, LLC
- Selim Eminoglu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Vertical electrical device
- Patent number 7,989,915
- Issue date Aug 2, 2011
- Teledyne Licensing, LLC
- Jeffrey F. DeNatale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low noise readout apparatus and method with snapshot shutter and co...
- Patent number 7,952,635
- Issue date May 31, 2011
- Teledyne Licensing, LLC
- Stefan Clemens Lauxtermann
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Backside illuminated CMOS image sensor with photo gate pixel
- Patent number 7,936,039
- Issue date May 3, 2011
- Teledyne Scientific & Imaging, LLC
- Stefan Clemens Lauxtermann
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Two-dimensional time delay integration visible CMOS image sensor
- Patent number 7,923,763
- Issue date Apr 12, 2011
- Teledyne Licensing, LLC
- Stefan C. Lauxtermann
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Through-wafer vias
- Patent number 7,829,462
- Issue date Nov 9, 2010
- Teledyne Licensing, LLC
- Jeffrey F. DeNatale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for backside illuminated image sensors using c...
- Patent number 7,795,650
- Issue date Sep 14, 2010
- Teledyne Scientific & Imaging LLC
- Selim Eminoglu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Buried via technology for three dimensional integrated circuits
- Patent number 7,790,608
- Issue date Sep 7, 2010
- Teledyne Licensing, LLC
- Stefan C. Lauxtermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging system with low noise pixel array column buffer
- Patent number 7,755,689
- Issue date Jul 13, 2010
- Teledyne Licensing, LLC
- John C. Stevens
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Buried via technology for three dimensional integrated circuits
- Patent number 7,671,460
- Issue date Mar 2, 2010
- Teledyne Licensing, LLC
- Stefan C. Lauxtermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Charge multiplication CMOS image sensor and method for charge multi...
- Patent number 7,538,307
- Issue date May 26, 2009
- Teledyne Licensing LLC
- Stefan Lauxtermann
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Backside illuminated CMOS image sensor with pinned photodiode
- Patent number 7,498,650
- Issue date Mar 3, 2009
- Teledyne Licensing, LLC
- Stefan C. Lauxtermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Numerical full well capacity extension for photo sensors with an in...
- Patent number 7,436,342
- Issue date Oct 14, 2008
- Teledyne Licensing, LLC
- Stefan C. Lauxtermann
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR BACKSIDE ILLUMINATED IMAGE SENSORS USING C...
- Publication number 20110215222
- Publication date Sep 8, 2011
- Selim Eminoglu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
TWO-DIMENSIONAL TIME DELAY INTEGRATION VISIBLE CMOS IMAGE SENSOR
- Publication number 20110068382
- Publication date Mar 24, 2011
- Stefan Lauxtermann
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
BURIED VIA TECHNOLOGY FOR THREE DIMENSIONAL INTEGRATED CIRCUITS
- Publication number 20100151625
- Publication date Jun 17, 2010
- Teledyne Licensing, LLC
- Stefan C. Lauxtermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR BACKSIDE ILLUMINATED IMAGE SENSORS USING C...
- Publication number 20100140732
- Publication date Jun 10, 2010
- TELEDYNE SCIENTIFIC & IMAGING, LLC
- Selim Eminoglu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ADAPTIVE LOW NOISE OFFSET SUBTRACTION FOR IMAGERS WITH LONG INTEGRA...
- Publication number 20100123504
- Publication date May 20, 2010
- Stefan C. Lauxtermann
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
BACKSIDE ILLUMINATED CMOS IMAGE SENSOR WITH PHOTO GATE PIXEL
- Publication number 20100096675
- Publication date Apr 22, 2010
- Stefan Clemens Lauxtermann
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Low noise readout apparatus and method with snapshot shutter and co...
- Publication number 20090160989
- Publication date Jun 25, 2009
- Stefan Clemens Lauxtermann
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
LOW NOISE READOUT APPARATUS AND METHOD FOR CMOS IMAGE SENSORS
- Publication number 20090122173
- Publication date May 14, 2009
- William Emerson Tennant
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Imaging system with low noise pixel array column buffer
- Publication number 20090090846
- Publication date Apr 9, 2009
- TELEDYNE LICENSING, LLC
- John C. Stevens
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Through-wafer vias
- Publication number 20080272499
- Publication date Nov 6, 2008
- TELEDYNE LICENSING, LLC
- Jeffrey F. DeNatale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-DIMENSIONAL TIME DELAY INTEGRATION VISIBLE CMOS IMAGE SENSOR
- Publication number 20080217661
- Publication date Sep 11, 2008
- Teledyne Licensing, LLC
- Stefan Lauxtermann
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
BACKSIDE ILLUMINATED CMOS IMAGE SENSOR WITH PINNED PHOTODIODE
- Publication number 20080217723
- Publication date Sep 11, 2008
- Teledyne Licensing, LLC
- Stefan C. Lauxtermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NUMERICAL FULL WELL CAPACITY EXTENSION FOR PHOTO SENSORS WITH AN IN...
- Publication number 20080180112
- Publication date Jul 31, 2008
- Stefan C. Lauxtermann
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Vertical electrical device
- Publication number 20080122031
- Publication date May 29, 2008
- Rockwell Scientific Licensing, LLC
- Jeffrey F. DeNatale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURIED VIA TECHNOLOGY FOR THREE DIMENSIONAL INTEGRATED CIRCUITS
- Publication number 20070170574
- Publication date Jul 26, 2007
- Teledyne Licensing, LLC
- Stefan C. Lauxtermann
- H01 - BASIC ELECTRIC ELEMENTS

Stefan C. Lauxtermann

Person

Patents Grantslast 30 patents

Method and apparatus for backside illuminated image sensors using c...

Vertical electrical device

Low noise readout apparatus and method with snapshot shutter and co...

Backside illuminated CMOS image sensor with photo gate pixel

Two-dimensional time delay integration visible CMOS image sensor

Through-wafer vias

Method and apparatus for backside illuminated image sensors using c...

Buried via technology for three dimensional integrated circuits

Imaging system with low noise pixel array column buffer

Buried via technology for three dimensional integrated circuits

Charge multiplication CMOS image sensor and method for charge multi...

Backside illuminated CMOS image sensor with pinned photodiode

Numerical full well capacity extension for photo sensors with an in...

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR BACKSIDE ILLUMINATED IMAGE SENSORS USING C...

TWO-DIMENSIONAL TIME DELAY INTEGRATION VISIBLE CMOS IMAGE SENSOR

BURIED VIA TECHNOLOGY FOR THREE DIMENSIONAL INTEGRATED CIRCUITS

METHOD AND APPARATUS FOR BACKSIDE ILLUMINATED IMAGE SENSORS USING C...

ADAPTIVE LOW NOISE OFFSET SUBTRACTION FOR IMAGERS WITH LONG INTEGRA...

BACKSIDE ILLUMINATED CMOS IMAGE SENSOR WITH PHOTO GATE PIXEL

Low noise readout apparatus and method with snapshot shutter and co...

LOW NOISE READOUT APPARATUS AND METHOD FOR CMOS IMAGE SENSORS

Imaging system with low noise pixel array column buffer

Through-wafer vias

TWO-DIMENSIONAL TIME DELAY INTEGRATION VISIBLE CMOS IMAGE SENSOR

BACKSIDE ILLUMINATED CMOS IMAGE SENSOR WITH PINNED PHOTODIODE

NUMERICAL FULL WELL CAPACITY EXTENSION FOR PHOTO SENSORS WITH AN IN...

Vertical electrical device

BURIED VIA TECHNOLOGY FOR THREE DIMENSIONAL INTEGRATED CIRCUITS