Stefan Hampl

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Dresden, DE

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Patents Grantslast 30 patents

Information Patent Grant
Method for wafer bonding and compound semiconductor wafer
- Patent number 12,068,296
- Issue date Aug 20, 2024
- Infineon Technologies AG
- Stefan Hampl
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INFRARED RADIATION SOURCE
- Publication number 20230127662
- Publication date Apr 27, 2023
- INFINEON TECHNOLOGIES AG
- Stefan Hampl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR WAFER BONDING AND COMPOUND SEMICONDUCTOR WAFER
- Publication number 20220238501
- Publication date Jul 28, 2022
- Stefan Hampl
- H01 - BASIC ELECTRIC ELEMENTS