Stefan Kramp

Person

Villach, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Chip with a silicon carbide substrate
- Patent number 12,327,727
- Issue date Jun 10, 2025
- Infineon Technologies AG
- Stefan Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming a semiconductor device
- Patent number 11,842,938
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing an electrical contact on a silicon carbide su...
- Patent number 11,798,807
- Issue date Oct 24, 2023
- Infineon Technologies AG
- Stefan Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming a semiconductor device
- Patent number 11,217,500
- Issue date Jan 4, 2022
- Infineon Technologies AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical contact connection on silicon carbide substrate
- Patent number 11,043,383
- Issue date Jun 22, 2021
- Infineon Technologies AG
- Stefan Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and method for forming a chip pad
- Patent number 10,636,754
- Issue date Apr 28, 2020
- Infineon Technologies AG
- Stefan Kramp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,418,319
- Issue date Sep 17, 2019
- Infineon Technologies AG
- Oliver Haeberlen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and method for forming a chip pad
- Patent number 10,236,265
- Issue date Mar 19, 2019
- Infineon Technologies AG
- Stefan Kramp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and trench field plate field effect transistor...
- Patent number 9,905,685
- Issue date Feb 27, 2018
- Infineon Technologies Austria AG
- Ralf Siemieniec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method for manufacturing a semiconductor...
- Patent number 9,786,620
- Issue date Oct 10, 2017
- Infineon Technolgies AG
- Stefan Kramp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 8,441,804
- Issue date May 14, 2013
- Infineon Technologies AG
- Oliver Haeberlen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Chip with a Silicon Carbide Substrate
- Publication number 20230420257
- Publication date Dec 28, 2023
- INFINEON TECHNOLOGIES AG
- Stefan Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Forming a Semiconductor Device
- Publication number 20220093483
- Publication date Mar 24, 2022
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for Producing an Electrical Contact on a Silicon Carbide Su...
- Publication number 20210265168
- Publication date Aug 26, 2021
- INFINEON TECHNOLOGIES AG
- Stefan Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Contact Connection on Silicon Carbide Substrate
- Publication number 20190362973
- Publication date Nov 28, 2019
- Stefan Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Forming a Semiconductor Device
- Publication number 20190311966
- Publication date Oct 10, 2019
- INFINEON TECHNOLOGIES AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip and Method for Forming a Chip Pad
- Publication number 20190189574
- Publication date Jun 20, 2019
- INFINEON TECHNOLOGIES AG
- Stefan Kramp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING A SEMICONDUCTOR...
- Publication number 20170033067
- Publication date Feb 2, 2017
- INFINEON TECHNOLOGIES AG
- Stefan Kramp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Trench Field Plate Field Effect Transistor...
- Publication number 20160322489
- Publication date Nov 3, 2016
- Infineon Technologies Austria AG
- RALF SIEMIENIEC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip and Method for Forming a Chip Pad
- Publication number 20160027746
- Publication date Jan 28, 2016
- INFINEON TECHNOLOGIES AG
- Stefan Kramp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20130252382
- Publication date Sep 26, 2013
- Oliver Haeberlen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20100019381
- Publication date Jan 28, 2010
- INFINEON TECHNOLOGIES AG
- Oliver Haeberlen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20090230519
- Publication date Sep 17, 2009
- INFINEON TECHNOLOGIES AG
- Ralf OTREMBA
- H01 - BASIC ELECTRIC ELEMENTS

Stefan Kramp

Person

Patents Grantslast 30 patents

Chip with a silicon carbide substrate

Semiconductor device and method for forming a semiconductor device

Process for producing an electrical contact on a silicon carbide su...

Semiconductor device and method for forming a semiconductor device

Electrical contact connection on silicon carbide substrate

Semiconductor chip and method for forming a chip pad

Method of manufacturing a semiconductor device

Semiconductor chip and method for forming a chip pad

Semiconductor device and trench field plate field effect transistor...

Semiconductor device and a method for manufacturing a semiconductor...

Semiconductor device and method of manufacturing a semiconductor de...

Patents Applicationslast 30 patents

Chip with a Silicon Carbide Substrate

Semiconductor Device and Method for Forming a Semiconductor Device

Process for Producing an Electrical Contact on a Silicon Carbide Su...

Electrical Contact Connection on Silicon Carbide Substrate

Semiconductor Device and Method for Forming a Semiconductor Device

Semiconductor Chip and Method for Forming a Chip Pad

SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING A SEMICONDUCTOR...

Semiconductor Device and Trench Field Plate Field Effect Transistor...

Semiconductor Chip and Method for Forming a Chip Pad

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

Semiconductor Device