Stefan Krivec

Person

Arnoldstein, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for forming a semiconductor device
- Patent number 11,842,938
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing an electrical contact on a silicon carbide su...
- Patent number 11,798,807
- Issue date Oct 24, 2023
- Infineon Technologies AG
- Stefan Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming a semiconductor device
- Patent number 11,217,500
- Issue date Jan 4, 2022
- Infineon Technologies AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a silicon-insulator layer and semiconductor devi...
- Patent number 11,195,713
- Issue date Dec 7, 2021
- Infineon Technologies AG
- Joachim Hirschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical contact connection on silicon carbide substrate
- Patent number 11,043,383
- Issue date Jun 22, 2021
- Infineon Technologies AG
- Stefan Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device having a Schottky c...
- Patent number 10,763,339
- Issue date Sep 1, 2020
- Infineon Technologies Austria AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with non-ohmic contact between SiC and a conta...
- Patent number 10,431,698
- Issue date Oct 1, 2019
- Infineon Technologies Austria AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component, method for processing a substrate and meth...
- Patent number 10,361,096
- Issue date Jul 23, 2019
- Infineon Technologies AG
- Mathias Plappert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for manufacturing a semiconductor device having a non-ohmic...
- Patent number 10,199,514
- Issue date Feb 5, 2019
- Infineon Technologies Austria AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a barrier layer made of amorphous molyb...
- Patent number 9,997,459
- Issue date Jun 12, 2018
- Infineon Technologies AG
- Jochen Hilsenbeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a layer structure having partially sealed p...
- Patent number 9,929,111
- Issue date Mar 27, 2018
- Infineon Technologies AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing the same
- Patent number 9,685,347
- Issue date Jun 20, 2017
- Infineon Technologies AG
- Jochen Hilsenbeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method
- Patent number 9,660,037
- Issue date May 23, 2017
- Infineon Technologies Austria AG
- Arno Zechmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device having a contact pad w...
- Patent number 9,620,466
- Issue date Apr 11, 2017
- Infineon Technologies AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing the same
- Patent number 9,595,469
- Issue date Mar 14, 2017
- Infineon Technologies AG
- Jochen Hilsenbeck
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Chip with a Silicon Carbide Substrate
- Publication number 20230420257
- Publication date Dec 28, 2023
- INFINEON TECHNOLOGIES AG
- Stefan Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT, CHIP PACKAGE, METHOD OF FORMING A CHIP ARRANGEMEN...
- Publication number 20230274996
- Publication date Aug 31, 2023
- INFINEON TECHNOLOGIES AG
- Stefan SCHWAB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Forming a Semiconductor Device
- Publication number 20220093483
- Publication date Mar 24, 2022
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for Producing an Electrical Contact on a Silicon Carbide Su...
- Publication number 20210265168
- Publication date Aug 26, 2021
- INFINEON TECHNOLOGIES AG
- Stefan Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming a Silicon-Insulator Layer and Semiconductor Devi...
- Publication number 20190385842
- Publication date Dec 19, 2019
- Joachim Hirschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Contact Connection on Silicon Carbide Substrate
- Publication number 20190362973
- Publication date Nov 28, 2019
- Stefan Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Forming a Semiconductor Device
- Publication number 20190311966
- Publication date Oct 10, 2019
- INFINEON TECHNOLOGIES AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Manufacturing a Semiconductor Device Having a Non-Ohmic...
- Publication number 20190140111
- Publication date May 9, 2019
- Infineon Technologies Austria AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Manufacturing a Semiconductor Device Having a Non-Ohmic...
- Publication number 20180158964
- Publication date Jun 7, 2018
- Infineon Technologies Austria AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT, METHOD FOR PROCESSING A SUBSTRATE AND METH...
- Publication number 20180053663
- Publication date Feb 22, 2018
- INFINEON TECHNOLOGIES AG
- Mathias Plappert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Producing a Semiconductor Device
- Publication number 20170243828
- Publication date Aug 24, 2017
- INFINEON TECHNOLOGIES AG
- Jochen Hilsenbeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A LAYER STRUCTURE HAVING PARTIALLY SEALED P...
- Publication number 20170194272
- Publication date Jul 6, 2017
- INFINEON TECHNOLOGIES AG
- Martin MISCHITZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD
- Publication number 20170170282
- Publication date Jun 15, 2017
- Infineon Technologies Austria AG
- Arno Zechmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing a Semiconductor Device Having a Schottky C...
- Publication number 20160276452
- Publication date Sep 22, 2016
- Infineon Technologies Austria AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Processing a Semiconductor Surface
- Publication number 20160211140
- Publication date Jul 21, 2016
- INFINEON TECHNOLOGIES AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Manufacturing a Semiconductor D...
- Publication number 20160181441
- Publication date Jun 23, 2016
- Infineon Technologies Austria AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A STRESS-COMPENSATED CHIP ELECTRODE
- Publication number 20160126197
- Publication date May 5, 2016
- INFINEON TECHNOLOGIES AG
- Kurt Matoy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Producing the Same
- Publication number 20150123145
- Publication date May 7, 2015
- INFINEON TECHNOLOGIES AG
- Jochen Hilsenbeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Producing the Same
- Publication number 20150123149
- Publication date May 7, 2015
- INFINEON TECHNOLOGIES AG
- Jochen Hilsenbeck
- H01 - BASIC ELECTRIC ELEMENTS

Stefan Krivec

Person

Patents Grantslast 30 patents

Semiconductor device and method for forming a semiconductor device

Process for producing an electrical contact on a silicon carbide su...

Semiconductor device and method for forming a semiconductor device

Methods of forming a silicon-insulator layer and semiconductor devi...

Electrical contact connection on silicon carbide substrate

Method for manufacturing a semiconductor device having a Schottky c...

Semiconductor device with non-ohmic contact between SiC and a conta...

Semiconductor component, method for processing a substrate and meth...

Methods for manufacturing a semiconductor device having a non-ohmic...

Semiconductor device having a barrier layer made of amorphous molyb...

Method of manufacturing a layer structure having partially sealed p...

Semiconductor device and method for producing the same

Semiconductor wafer and method

Method of manufacturing an electronic device having a contact pad w...

Semiconductor device and method for producing the same

Patents Applicationslast 30 patents

Chip with a Silicon Carbide Substrate

CHIP ARRANGEMENT, CHIP PACKAGE, METHOD OF FORMING A CHIP ARRANGEMEN...

Semiconductor Device and Method for Forming a Semiconductor Device

Process for Producing an Electrical Contact on a Silicon Carbide Su...

Methods of Forming a Silicon-Insulator Layer and Semiconductor Devi...

Electrical Contact Connection on Silicon Carbide Substrate

Semiconductor Device and Method for Forming a Semiconductor Device

Methods for Manufacturing a Semiconductor Device Having a Non-Ohmic...

Methods for Manufacturing a Semiconductor Device Having a Non-Ohmic...

SEMICONDUCTOR COMPONENT, METHOD FOR PROCESSING A SUBSTRATE AND METH...

Semiconductor Device and Method for Producing a Semiconductor Device

METHOD OF MANUFACTURING A LAYER STRUCTURE HAVING PARTIALLY SEALED P...

SEMICONDUCTOR WAFER AND METHOD

Method for Manufacturing a Semiconductor Device Having a Schottky C...

Method for Processing a Semiconductor Surface

Semiconductor Device and Method for Manufacturing a Semiconductor D...

SEMICONDUCTOR DEVICE HAVING A STRESS-COMPENSATED CHIP ELECTRODE

Semiconductor Device and Method for Producing the Same

Semiconductor Device and Method for Producing the Same