Stefan Leopold HATZL

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Munchen, DE

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Patents Grantslast 30 patents

Information Patent Grant
Micro-acoustic wafer-level package and method of manufacture
- Patent number 12,071,339
- Issue date Aug 27, 2024
- RF360 SINGAPORE PTE. LTD.
- Manuel Hofer
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MICRO-ACOUSTIC WAFER-LEVEL PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20210395076
- Publication date Dec 23, 2021
- RF360 Europe GmbH
- Manuel HOFER
- B81 - MICRO-STRUCTURAL TECHNOLOGY